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Zuken and CSA Catapult Present Results of R&D CollaborationDecember 8, 2022 | Zuken
Estimated reading time: 1 minute
Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are announcing an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products.
CSA Catapult is a UK government-funded non-profit organization headquartered in South Wales that was founded to help the UK become a global leader in compound semiconductors. Working with both large companies and start-ups, CSA Catapult develops and commercializes new semiconductor technology applications.
Collaborating with Zuken on a project to bring a power module layout from a graphical concept to a 3D model, CSA Catapult has identified several requirements and optimizations to Zuken’s CR-8000 Design Force chip, package and PCB co-design software that will provide designers of power electronic products with the ability to co-develop mechanical and electrical design in unison. The integration with industry simulation tools enables the efficient design iteration needed to effectively explore the design envelope for new compound semiconductor products.
As a result of the collaboration, an intuitive function was created to generate interconnections between chips and copper layers in a substrate or a printed circuit board, as well as a function to export a CAD model in a format compatible with FEM software. These advanced features will help designers significantly decrease the time required to generate a 3D model of the power module substrate, chip layout, and chip-to-chip, as well as chip-to-copper interconnections.
Dr. Alejandro Villarruel Parra, senior power electronics engineer at CSA Catapult, said, “The creation of a 3D model of the substrate, chip layout, and chip interconnections is an important part of the early-stage power module design process. Zuken’s advanced design solutions have helped to provide a preview of the module performance, which in turn makes our decision-making process faster when several concepts are being compared or helps to steer the refinement of the module geometry if a concept has already been selected.”
The new capability is included in the 2022 release of CR-8000 Design Force.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.