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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC Issues New Report, The Evolution of Factories on the Future: What You Need to KnowDecember 13, 2022 | IPC
Estimated reading time: 1 minute
IPC recently convened a roundtable of electronics executives to discuss trends driving the industry’s migration to the factory of the future. The executives came to a shared conclusion that the transition to the factory of the future features many challenges and pitfalls but making the transition will be increasingly critical to any company seeking to compete in the global economy. A summary of the discussion is now available: “The Evolution of Factories of the Future: What You Need to Know.”
In reaching their conclusion, the roundtable participants discussed common barriers in adopting smart manufacturing technologies and skill disparities in the electronics manufacturing workforce. They also shared practices they believed to be important as companies work to increase digitization and enhance manufacturing operations. Among other topics, company leaders talked about creating a workplace culture that embraces change and innovation.
“Executives agreed that despite the challenges in transitioning to the factory of the future, they have recognized the value in doing so and are now looking to integrate solutions that will deliver measurable benefits to their company,” said Matt Kelly, IPC chief technologist.
To view report, visit www.ipc.org/F2report. IPC offers additional resources to assist and guide the electronics manufacturing industry through the next industrial revolution. For more information, visit www.ipc.org/solutions/ipc-factory-future or www.ipc.org/advocacy/industry-intelligence.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.
I-Connect007 is excited to announce the latest season of its popular podcast, On the Line With..., where industry experts share the latest insights and perspectives on the most relevant topics in the electronics industry. In this new season, “PCB 3.0: A New Design Methodology,” host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this first episode, Product Management Director Patrick Davis addresses the need for change.