Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
TRI to Join NEPCON Japan 2023
December 19, 2022 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, will join NEPCON Japan 2023, held at Tokyo Big Sight from January 25 – 27, 2023, to showcase state-of-the-art Test and Inspection Solutions for the Smart Factory. Visit booth #14-38 to experience the latest test and inspection innovations for the PCBA Industry.
TRI welcomes you to join us at NEPCON Japan to learn how TRI's AI algorithms and metrology help boost your production intelligence.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. Also, TRI will unveil the 3D AOI TR7700QM SII for high-reliability industries with superior specifications of a 25MP camera, 2.5 um high-resolution, AI-Powered, and Metrology Ready.
Also presenting at NEPCON Japan will be the 3D SPI TR7007QI and the world-class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications. The most compact ICT in the market, TR5001T SII Tiny, will be showcased.
The AI solutions from TRI include AI Smart Programming, AI Repair Station, and more. TRI's test and inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Join us at NEPCON Japan 2023 booth #14-38 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.