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TRI to Join NEPCON Japan 2023
December 19, 2022 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, will join NEPCON Japan 2023, held at Tokyo Big Sight from January 25 – 27, 2023, to showcase state-of-the-art Test and Inspection Solutions for the Smart Factory. Visit booth #14-38 to experience the latest test and inspection innovations for the PCBA Industry.
TRI welcomes you to join us at NEPCON Japan to learn how TRI's AI algorithms and metrology help boost your production intelligence.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. Also, TRI will unveil the 3D AOI TR7700QM SII for high-reliability industries with superior specifications of a 25MP camera, 2.5 um high-resolution, AI-Powered, and Metrology Ready.
Also presenting at NEPCON Japan will be the 3D SPI TR7007QI and the world-class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications. The most compact ICT in the market, TR5001T SII Tiny, will be showcased.
The AI solutions from TRI include AI Smart Programming, AI Repair Station, and more. TRI's test and inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Join us at NEPCON Japan 2023 booth #14-38 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.