-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Releases IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies
December 26, 2022 | IPCEstimated reading time: Less than a minute

IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies prescribes practices and requirements for the manufacturing of cable, wire, and harness assemblies, and describes materials, methods, tests, and acceptability criteria for producing crimped, mechanically secured, and soldered interconnections, and the related assembly activities associated with cable and harness assemblies.
Revision E showcases significant changes to the standard, at the request of the industry. The WHMA/IPC-A-620 standards development committee adopted a new chaptering system for the entire document, added new figures and updated several sections of the standard. Of significance was the alignment of soldering requirements with IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The Circular Mill Area was revised and terms and definitions in Appendix A were updated.
“IPC/WHMA-A-620E sets expectations between WHMA members and their customers for what is considered acceptable quality workmanship for cables and harnesses,” said David Bergman, IPC vice president of standards and technology. “The revisions requested by the industry were significant, resulting in a much-improved standard.”
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.