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The Most-read I-Connect007 Articles of 2022
December 26, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like an Avril Lavigne album
So, grab a cup of eggnog and curl up by the fire! For your holiday enjoyment, here’s a blast from the past: the top five most-read I-Connect007 articles of 2022.
Review: Institute of Circuit Technology 2022 Annual Symposium
Once again, European Technical Editor Pete Starkey holds onto the top spot. Pete covers conferences and trade shows around Europe. Everything Pete writes is golden, and he has fans across Europe and around the world. Stop by our booth at IPC APEX EXPO and say hi to Pete.
Jahr Turchan Discusses Blackfox's Training Scholarships for Veterans
Nolan Johnson’s interview with Jahr Turchan of Blackfox Training Institute drew a lot of eyes to the page. There’s a shortage of subject matter experts in the industry, and Blackfox’s Veteran Advanced Manufacturing Certification program is helping bring transitioning veterans into the workplace. We need more ideas like this.
Finally! A Book About PCB Stackups
The PCB design industry is hungry for information about stackup design, and Bill Hargin of Z-zero seems to have written the right book at the right time. This I-Connect007 eBook has been flying off the virtual bookshelves all year. It would make a perfect late Christmas present.
PCB Plating Still Comes Down to Physics
As I said, we never know what articles are going to hit it big each year. This interview with columnist Michael Carano covered the ins and outs of plating technologies and processes, which might seem like a fairly “mature” topic. But this interview drew big numbers. Readers are looking for information, and we seem to have what they’re looking for.
A Definitive Review of New Expert Guide to High-Performance Materials
This year, we published a variety of eBooks on topic from across the spectrum. Happy Holden’s review of the I-Connect007 eBook The Printed Circuit Designer’s Guide to… High Performance Materials really took off. As Happy explains, this book, written by Michael Gay of Isola, lays out everything you need to know about high performance PCB materials.
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
IPC-CFX, 2.0: How to Use the QPL Effectively
07/02/2025 | Chris Jorgensen, Global Electronics AssociationIn part one of this series, we discussed the new features in CFX Version 2.0 and their implications for improved inter-machine communication. But what about bringing this new functionality to the shop floor? The IPC-CFX-2591 QPL is a powerful technical resource for manufacturers seeking CFX-enabled equipment. The Qualified Product List (QPL) helps streamline equipment selection by listing models verified for CFX compliance through a robust third-party virtual qualification process.
Advancing Aerospace Excellence: Emerald’s Medford Team Earns Space Addendum Certification
06/30/2025 | Emerald TechnologiesWe’re thrilled to announce a major achievement from our Medford, Oregon facility. Andy Abrigo has officially earned her credentials as a Certified IPC Trainer (CIT) under the IPC J-STD-001 Space Addendum, the leading industry standard for space and military-grade electronics manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.