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First EUV Light Marks Intel 4 Milestone in Ireland
December 27, 2022 | IntelEstimated reading time: 1 minute
Fab 34 in Ireland took delivery this year of its first extreme ultraviolet (EUV) lithography system, a key enabler of Intel 4 process technology. Since its arrival, Intel Ireland teams have been working through the installation phase of the system made by Dutch manufacturer ASML. This week, they reached an important moment when the EUV scanner generated its 13.5-nanometer wavelength light for the first time.
This milestone at the fab in Leixlip, Ireland, is a key step on Intel’s path toward high-volume production of Intel 4 technology and is the first time a high-volume EUV scanner will be used in Europe.
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Celestica Provides Update on New Operations in Fort Worth, Texas
05/15/2026 | CelesticaCelestica Inc. a global leader in data center infrastructure and advanced technology solutions, provided an update on its plans to establish operations in AllianceTexas in Fort Worth, Texas.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.