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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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How Smart are Your Manufacturing Processes?
January 6, 2023 | IPCBlogImportEstimated reading time: Less than a minute
IPC has partnered with Auburn University to conduct a study on behalf of the Department of Defense (DoD) that can significantly help our nation’s manufacturing industries, and we would like your help. The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is working to help manufacturers engage with technology to improve competitiveness and profitability.
This survey is Year 2 of a five-year study. The survey should not take more than 10 minutes of your time. We will not be asking for any sensitive information, and your name and your company’s name will not be associated with any information provided unless you give permission. Your insights will help us better understand several overarching industry issues. If you would like, we will provide you with the resulting publication at the conclusion of the study.
We hope that you are willing to help with this project. If so, please begin the survey by clicking here.
You may close the survey and return to finish it later if needed.
If you have questions, please contact the Auburn ICAMS team at icams@auburn.edu.
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SEMICON Japan 2024 Opens Tomorrow to Highlight Smart Applications Powered by Semiconductor Technology
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Regal Rexnord, Honeywell To Collaborate On Solutions For Advanced Aircraft Mobility And eVTOL Markets
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SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB
12/09/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB.
Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
12/09/2024 | Kelly Scanlon, IPC Lead Sustainability StrategistThe electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.