Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Target Condition: Floor Planning Without a Floor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
EMC 800GbE Ethernet Solutions with New Material Offering at Designcon 2023
January 23, 2023 | Elite Material Co. LtdEstimated reading time: 1 minute
At DesignCon 2023, drop by EMC/ Arlon booth #955 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers have completed. The company will highlight how their extreme low-loss solutions EM-892K and EM-892K2 materials continue to rise as the best in class for its loss group.
They are formulated with a ruggedized resin foundation that enables continued solid performance through various thermal excursions. They have withstood up to 7 lamination cycles for high density interconnect. The number of Tier 1 OEMs opting for this EMC’s 800G laminate solution for their next generation needs, has continued to grow.
EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS needs designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8%, sampling currently is available for testing.
Another segment of Industry support by EMC taking shape is the IC Substrate sector. With our EM-S530 and EM-S570 substrate materials, we are breaking grounds to be the first Taiwan based substrate material provider outside of the traditional Japanese brand dominance.
For dedicated mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment; Arlon’s introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system, also meets IPC-4101 slash sheets 40 and 41.
86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85?C/ 100V DC, low-Z-axis expansion of less than 1% between 50?C to 260?C for high layer count MLB’s, very high decomposition temperatures of 430?C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs using up to seven additional lamination steps. 86HP applications include mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment. 86HP meets IPC-4101 slash sheets 40, 41, and 43.
For more information about Elite Materials please visit the EMC website at www.emctw.com.
For more information on ARLON EMD please visit www.arlonemd.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
KYZEN Partners with LPW to Elevate High Purity Cleaning with Cutting-Edge Cyclic Nucleation Technology in North America
08/13/2025 | KYZEN'KYZEN, a global leader in advanced cleaning solutions, has reached a major milestone in high-purity cleaning with the addition of a state-of-the-art Vacuum Cyclic Nucleation System at its North American Application Lab.
Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain
08/12/2025 | I-Connect007 Editorial TeamJeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.
New Frontier Aerospace and Air Force Institute of Technology Sign CRADA to Advance Hypersonic VTOL Aircraft
08/05/2025 | PR NewswireNew Frontier Aerospace (NFA) is excited to announce a Collaborative Research and Development Agreement (CRADA) with the Air Force Institute of Technology (AFIT) aimed at advancing an innovative rocket-powered hypersonic Vertical Takeoff and Landing (VTOL) aircraft.
Honeywell Advances Technology That Lets Fighter Pilots Breathe Easier for Peak Performance
08/04/2025 | HoneywellHoneywell has developed and launched a new technology that allows military pilots of high-performance fighter jets to breathe easier under extreme conditions.