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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC Debuts First Issue of IPC Community at IPC APEX EXPO 2023January 24, 2023 | IPC
Estimated reading time: 2 minutes
Monday at IPC APEX EXPO 2023, IPC, in partnership with IPC Publishing Group, launched an industry-specific quarterly publication (a digital publication with a special print edition for show participants), “IPC Community.” The publication celebrates member success while sharing the important work being done within the association to better serve its members and the global electronics manufacturing community.
With news and information to help readers be more competitive and profitable, the debut issue provides information on manufacturing and management best practices and solutions, emerging technologies, IPC standards, government relations issues, industry intelligence, advanced packaging, sustainability regional office updates, and more.
“The name ‘Community’ refers to all of us – the global team of electronics manufacturers throughout the vast supply chain,” said IPC President and CEO John Mitchell. “’IPC Community’ is our way of honoring and serving that connection, that community of individuals who share the same goal and who work together to build electronics better,” Mitchell added. “We’re excited about the possibilities of this quarterly magazine taking our ability to disseminate important information to the next level, all while making sure member stories and voices are reflected and commemorated.”
“Articles within ‘IPC Community’ are written to appeal to our members, to provide them with must-read, relevant and timely content,” said Brian Knier, IPC chief marketing officer. The editorial team is committed to providing news items that are of high value, but we encourage reader feedback. We want readers to share their success stories with us – to suggest any editorial content, please reach out to Managing Editor Michelle Te, at MichelleTe@ipc.org.”
“Developing this publication has been such a joy,” said Michelle Te. “It has been the members and readers that propelled our efforts forward in developing it and seeing it through. Their hard work and dedication to the electronics manufacturing industry are what have made the collaboration so special. I’m excited to share this first issue and look forward to the many more stories we will be able to tell in future issues.”
The second quarter issue of IPC Community will be distributed on April 15, 2023. To subscribe to “IPC Community,” visit www.ipccommunity.org. For inquiries regarding advertising opportunities within the magazine, contact Barb Hockaday, ad sales manager, at BarbHockaday@ipc.org or view media kit.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, test and advanced packaging. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Atlanta, Georgia; Washington, D.C.; Orlando, Fla.; Munich, Germany; Brussels, Belgium; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.
I-Connect007 is excited to announce the latest season of its popular podcast, On the Line With..., where industry experts share the latest insights and perspectives on the most relevant topics in the electronics industry. In this new season, “PCB 3.0: A New Design Methodology,” host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this first episode, Product Management Director Patrick Davis addresses the need for change.