Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
A Challenge Facing Aerospace Designers In 2023
January 24, 2023 | Lee Ritchey, Speeding EdgeEstimated reading time: Less than a minute
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication.
Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
The designers decided to reach down from the outer layer to the third layer below the surface using stacked blind vias.
The process used to create the structure in Figure 1 is to fabricate a PCB using the ordinary lamination, drilling, and plating processes employed for any multilayer PCB. Once this is done, a laser drill is used to create the first blind via at the bottom of the stack as shown in Figure 1.
To read this entire article, which appeared in the January 2023 issue of Design007 Magazine, click here.
Share on:
Suggested Items
AdvancedPCB Appoints Gary Stoffer as Chief Commercial Officer
04/18/2025 | PRNewswireAdvancedPCB is proud to announce the appointment of Gary Stoffer as its new Chief Commercial Officer (CCO). In this role, Stoffer will lead all sales, marketing, and commercial strategy initiatives as the company continues its mission to deliver cutting-edge PCB solutions to industries worldwide.
Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
04/15/2025 | Real Time with...IPC APEX EXPOThings are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.
Apogee Semiconductor Teams with Arrow Electronics to Expand Distribution of Space-Grade Technologies
04/14/2025 | Apogee SemiconductorApogee Semiconductor, a leading provider of advanced technologies for space and extreme environments, announced its collaboration with Arrow Electronics, a global distributor of electronic components and services.
Satair, RTX’s Collins Aerospace Extend 50-year Relationship
04/14/2025 | Collins AerospaceSatair and Collins Aerospace, an RTX business, have signed a four-year extension of their cabin interior parts distribution agreement, continuing a relationship that has spanned more than 50 years.
FTG Announces Q1 2025 Financial Results
04/10/2025 | Firan Technology Group CorporationIn Q1 2025, the Corporation grew through acquisition and organically. FTG is strategically investing its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. The company's achievements in Q1 2025 demonstrate this commitment, laying a strong foundation for future growth.