-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Integra: Redefining Die Prep in the U.S.
January 25, 2023 | Matt Bergeron, IntegraEstimated reading time: 1 minute
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.
For over 40 years, Integra has held its position as the largest outsourced semiconductor assembly and test (OSAT) operation in the U.S.—an accomplishment considering that most of our competition (and a few of our former owners) have given up on manufacturing in the U.S. altogether. Five years ago, customers and suppliers were saying things like, “When are you opening a facility in Asia?” and “What volume facility are you tied to?” Having a factory in the U.S. was considered laughable.
But with the arrival of COVID-19 and all its supply chain disruptions—not to mention the current precarity of global politics—there came a realization that we are increasingly dependent on Asia for manufacturing. The CHIPS Act has generated new discussions; now we hear comments like, “We’ve said all along that we need to bring manufacturing back to the U.S.,” and “We’re building a factory here too.” People who laughed when we had a U.S. presence are now asking if we can help them get substrates sooner.
While most folks were moving out of the United States, we were looking for ways that we could make U.S. manufacturing work. We focused on two core ideas: products that are differentiated, and customers that can’t or won’t go to Asia.
With respect to differentiated products, we specifically targeted unique processes, such as SiPho, III-V materials, etc.; unique and unruly requirements in low-volume quantities (qualification runs, DPA, test, etc.); and volumes that Asia typically will not accept. This last criterion also happened to fit with the space technology sector quite well.
To read this entire article, which appeared in the January 2023 issue of SMT007 Magazine, click here.
Suggested Items
SP Manufacturing Celebrates Grand Opening of New Factory in Senai, Malaysia
10/29/2024 | SP ManufacturingSP Manufacturing Pte Ltd., a leader in comprehensive electronic manufacturing services, is thrilled to announce the grand opening of its new factory in Senai, Malaysia, marking a significant milestone in the company’s journey.
Tata Advanced Systems, Airbus Inaugurate C295 Final Assembly Line in Vadodara, India
10/28/2024 | AirbusAs a major milestone for India’s Aerospace & Defence industry, Tata Advanced Systems Limited (TASL) and Airbus inaugurated the Final Assembly Line (FAL) complex for the Airbus C295 aircraft in Vadodara, Gujarat in India.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/25/2024 | Marcy LaRont, I-Connect007Just this month, the Fall issue of IPC Community was released, spotlighting the global activities of IPC and its members. SMT007 Magazine covers the scary situation around counterfeit components. Design007 Magazine is not playing tricks with its hard-hitting discussions about “partial HDI.” (If you are asking yourself what that is, you really need to take a look.) Finally, PCB007 Magazine’s alternate metallization issue offers some real treats, including an interview featured this past week with Carmichael Gugliotti of MacDermid Alpha. In you’re in the U.S., here’s to an early Happy Halloween.
Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies
10/24/2024 | Rich DePoto, UyemuraIn this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.
2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
10/24/2024 | IPCThe 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.