-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha Showcases Solutions at Source India
February 13, 2023 | MacDermid AlphaEstimated reading time: 2 minutes

MacDermid Alpha, one of the world’s largest providers of solutions for circuitry, assembly, and semiconductor manufacturers within the electronics industry, will showcase automotive, 5G infrastructure, mobile devices, film, and surface finishing technologies at the Source India show; Chennai Trade Centre, February 13-14. Powering a path to the future of chemicals utilized in electronic applications, MacDermid Alpha will exhibit at booth A17-A20 in Hall 1, reflecting their strong local presence in India and ongoing support to resident OEMs, EMS providers, ODMs, CEMs, and distributors.
Visitors can expect to see a wide range of innovative technologies, specifically designed to improve the reliability and performance of electric vehicles, power electronics, battery control units, battery management systems, batteries, 5G applications, automotive electronics, and mobile devices. Solutions on show will include specific offerings for die attachment such as ALPHA® Argomax® silver sintering paste, ALPHA® ATROX, an ultra-low stress conductive die attach adhesive, and the SAC-based alloy, ALPHA® Innolot, for environments exposed to high temperature and vibration. Additionally, ALPHA® HRL3 Solid Solder is designed to enable low-temperature processes designed to mitigate defects in selective and dip soldering, thereby mitigating effects created by warpage. A range of Thermal Interface Materials, (TIMs), polymers/resins/potting compounds, and conformal coatings will also be available.
MacDermid Alpha’s broad portfolio will include chemicals for PCB fabrication including Blackhole® for lower cost of ownership and easier maintenance, high-performance films for smart surfaces, EMI shielding solutions, and superior battery component plating. In addition, pre- and post-treatments for the anodizing industry will be highlighted; these technologies are already exceeding the expectations of aluminum finishers around the world.
Experts from MacDermid Alpha will host three unmissable presentations at the technical conference on February 14. Gyan Dutt, Strategic Marketing Manager, Semiconductor Solutions, will present the paper ‘Advanced Materials for EV Powertrain and High-Reliability Applications’, covering high-reliability requirements for ADAS and connected applications in next-generation vehicles.
The second presentation will examine polymers/resins/potting compounds, TIMs, and conformal coatings solutions for EV batteries and power electronics. The presentation is titled ‘High-Performance?Polymer Protection and Thermal Management for Power Electronics and E-Mobility’ and will be hosted by Padmanabha Shakthivelu, General Manager of MacDermid Alpha’s Electrolube brand in India. Additionally, MacDermid Alpha’s OEM Sales Director (India), Sharan Aiyappa, will present the paper, ‘Film Insert Molding – Emergence of Display In-Mold Electronics and Smart Surfaces’ and will cover film insert molding technology for new automotive cockpit designs, especially those with curved surfaces, larger displays, more complex shapes, and integrated electronic functionality into plastic parts.
Padmanabha Shakthivelu, General Manager of MacDermid Alpha’s Electrolube brand in India, comments, “It is a fantastic opportunity for MacDermid Alpha, with unrivaled global R&D, and solutions that span the entire scope of the electronics supply chain, to interact with electronics manufacturers in India. We aim to demonstrate how we can significantly increase performance and reliability to the local market, with a focus on sustainability. With increasing global competition, rising expectations from consumers, and high pressure on supply chain operations, MacDermid Alpha’s local facilities in India can ensure chemical solutions developed to the highest global standards, highly efficient customer support, short lead times, and economies of scale.”
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.