-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
A First Look at IPC-CFX Box for Legacy Equipment
February 28, 2023 | Chris Jorgensen, IPCEstimated reading time: 1 minute
Although the prevalence of IPC-CFX in the electronics manufacturing industry has increased since the standard’s launch in spring 2019, the committee responsible for the standard has recognized legacy equipment in the field as a significant barrier to widespread industry adoption.
To address this, an A-Team under the IPC-CFX Standard Task Group spent the past year working on a project that provides simple, readily available IPC-CFX hardware with supporting SDK that can act as an IPC-CFX endpoint for existing legacy equipment. The goal of this add-on is to provide an accelerated path forward for industry IPC-CFX implementation.
The A-Team demonstrated an early success of its work during live demonstrations of a Raspberry Pi-based IPC-CFX box at the IPC booth at IPC APEX EXPO 2023.
About the IPC-CFX Raspberry Pi Box Endpoint Project
IPC-CFX provides genuine plug and play IIoT data exchange between machines and supervisory systems across the whole shop floor. To realize the benefit of IPC-CFX, however, the whole production station value chain should be considered, as any missing link becomes a blind spot for even the most basic visibility and control.
The focus of this project is to define an IPC-CFX standards-based open-hardware interface, designed to enable existing machines that cannot natively support IPC-CFX through software alone to become part of an IPC-CFX communication infrastructure.
The A-Team’s demonstration showed potential IPC-CFX users that there is a practical and affordable option for providing IPC-CFX support at any desired IPC-CFX endpoints where natively supported IPC-CFX machines are not available.
To read this entire article, which appeared in the 2023 issue of Show & Tell, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.