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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Numerical Innovations Releases ACE 2D/3D Translator V8
March 16, 2023 | Numerical InnovationsEstimated reading time: 1 minute
Numerical Innovations (NI) today announced its official release of ACE 2D/3D Translator Version 8.3.0 (64-bit).
ACE 2D/3D Translator is a "Full-Featured" CAD Software solution that will easily convert between ALL common EDA and CAD formats: DXF, Gerber, GDS-II, DWG, Postscript, PDF, HPGL, NC Drill/Rout, OASIS, Image files, ODB++, IPC-2581, SVG, and 3D formats STEP, STL.
The software allows users to convert CAD formats in just 4 STEPS! In addition, ACE has a friendly and modern GUI which drastically reduces the learning curve. Most users are able to successfully convert their first files in less than 5 minutes.
“ACE 2D/3D Translator is such a powerful CAD Conversion software solution – packed with Value and for a fraction of the price, when compared to other tools” states Miranda Yip, Chief Sales Officer of Numerical Innovations. “We are especially excited about the new and improved 3D Step, IPC-2581 and SVG export features!” mentions Yip.
ACE 2D/3D Translator is for designers of PCB’s, Microwave and RF circuits, as well as laser cutting and Inkjet printing manufacturers.
Listed below, are a few of the new features on V8 of ACE 2D/3D Translator:
- 3D Step Export. Extremely optimized B-Reps curves detection to minimize outputted STEP file size.
- New Export as Wireframe. Extremely fast and useful for reference in various 3D Software tools.
- IPC-2581 Export. New option to export compressed files (*.tgz, *.zip)
- SVG Export. Easily output optimized SVG files which can be useful for hundreds of purposes.
- Full support for Flex and Rigid-Flex Designs. Includes new Layer Subtypes, Stackup Zones & more.
- Open/Save Numerical Workspace files (*.wrk). 100% compatible with FAB 3000 and CloudDFM.com
- Align Layers in ACE Editor (menu: Edit | Align Layers). Easily Align any input data before export.
Many Fortune 500 companies trust ACE 2D/3D Translator for their critical designs, including Apple, Google, Microsoft, Intel, and AMD, to name a few. There are many customer testimonials listed on the ACE page at the NI website.
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Simon Khesin - Schmoll MaschinenSuggested Items
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
05/04/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.