-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Winners of IPC Hand Soldering Competition at InnoElectro 2023 Announced
April 5, 2023 | IPCEstimated reading time: 1 minute

IPC hosted a Hand Soldering Competition in Budapest, Hungary, at InnoElectro March 28-30, welcoming 42 competitors from 29 European electronics companies. Skilled contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality. Contestants were allowed a maximum of one hour to complete the process.
Taking top honors this year were:
- In first place for the second consecutive year, Peter Zsombok, BHE Bonn Hungary KFT, scored 538 points out of a maximum possible 558. Zsombok will compete for the World Championship title in November at productronica in Munich.
- Second place: Viktor Czonka, Alpine Hungary, with a score of 535 out of 558.
- Third place: Janos Szebelledi, BHE Bonn Hungary KFT, with a score of 529 out of 558.
This year’s Best Company Team trophy was presented to BHE Bonn Hungary KFT, for a combined score of 1028, achieved by team members Peter Zsombok and Janos Szebelledi.
IPC is grateful to the HSC sponsors for their generous support:
- Gold sponsors: Weller Tools, Thales
- Silver Sponsors: Almit, Ateliers Systems, NCAB Group, Optilia, Polygone CAO, SFM-Societe Française de Microscopie
“IPC thanks and congratulates all the participants and their companies for their interest and for taking up the hand soldering competition challenge,” said Philippe Leonard, IPC Europe director. “The competition board was very complex this year, and the contestants rose to the challenge with amazing performances. We look forward to more exciting competitions this year, ending with the World Championship at productronica in Munich.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.
ZenaTech Advances Taiwan Facility to Commissioning for NDAA-Compliant Drone Component Production
10/08/2025 | Globe NewswireZenaTech, Inc., a business technology solution provider specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), Enterprise SaaS, and Quantum Computing solutions, announces that its Taipei, Taiwan-based Spider Vision Sensors (SVS) subsidiary has advanced to the commissioning phase and assembly line setup at its recently leased 16,000 square-foot drone components manufacturing facility.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
UST, Kaynes Semicon Partner to Set Up Rs 3,330 Crore Joint Venture for Semiconductor Manufacturing in India
09/30/2025 | PRNewswireUST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer.
Indium Expert to Present on Solder Paste Solutions at SMTA Empire Expo and Tech Forum
09/29/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.