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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC SummerCom: Helping the Electronics Manufacturing Industry Build Electronics Better
April 10, 2023 | IPCEstimated reading time: 1 minute
Hundreds of experts from around the world will discuss electronics manufacturing standards in more than 80 meetings May 13–18 at IPC SummerCom in Milwaukee.
Facilitated by representatives from OEMs, PCB manufacturers, EMS providers, design firms, and other organizations, IPC standards development committees establish benchmarks for excellence in electronics manufacturing.
According to David Bergman, IPC vice president of standards and technology, IPC has more than 300+ active multilingual standards that cover nearly every stage of the electronics development product cycle.
“IPC SummerCom is all about IPC standards, and through standards development committee meetings, everyone in the industry can engage in an exchange of ideas about current industry trends as well as the identification of new standards and updates to current ones,” said Bergman. “Used by companies of all sizes in more than 90 countries by all manufacturing sectors, IPC standards help the electronics manufacturing industry build electronics better.
Standards development committee meetings will cover industry benchmarks in assembly and joining; assembly equipment, base materials; cleaning and coating; electronic documentation technology; electronic product data description; embedded devices; environment, health and safety; fabrication processes; flexible and rigid-flex printed boards; high speed/high frequency interconnection; management; packaged electronic components; printed board design technology, printed electronics; process control; product assurance; product reliability; rigid printed boards; terms and definitions; testing; and wearable electronics/e-textiles.
In addition to standards meetings, IPC will celebrate the accomplishments of “IPC A-Teams” at the Golden Gnomes Award Ceremony on May 16. The awards, inspired by IPC’s fictional TechNet gnomes Clumpy and Kloumpios, recognize the outstanding and creative work of IPC A-Teams. IPC A-Teams are dedicated groups of volunteers within IPC working groups who take on a significant amount of work on behalf of their groups.
This year, IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE) at the Wisconsin Center. IPC SummerCom registration gives participants free access to EWPTE. For more information on standards development activities at IPC SummerCom or to register, visit ipc.org/event/ipc-summercom. For more information on all IPC standards development activities, visit ipc.org/standards.
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Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
GPV Boosts Profitability Amid Challenging Market
05/05/2026 | GPVDanish-based GPV, the second-largest European-headquartered EMS company, reported improved profitability in the first quarter of 2026 despite continued market uncertainty and supply chain challenges.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
Nolan’s Notes: Our Spotlight on North America
05/05/2026 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we wrap up our electronics world tour with a final stop in the United States and Canada, where we look at the challenges, opportunities, and geopolitical dynamics affecting the market today. What makes American electronics unique? Key U.S. administration policy decisions, like tariffs, are significantly affecting electronics manufacturing. Others, such as the current conflict with Iran and the associated closures of the Strait of Hormuz, affect the raw materials that feed our supply chain.
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.