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Pemtron Wins 2023 EM Innovation Award for Its TWIN 3D AOI System
April 14, 2023 | Pemtron TechnologyEstimated reading time: 1 minute
Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce that it received a 2023 EM Innovation Award in the category of Inspection – AOI for its EAGLE 3D 8800 TWIN 3D Automated Optical Inspection system. The award was announced at a ceremony that took place April 14, 2023 during productronica China in Shanghai.
Steven Wongsonvanee, Pemtron General Manager – Americas, stated, “I am honored to announce that Pemtron has won the 2023 EM Innovation Award for the TWIN 3D AOI System. This cutting-edge technology represents a major step forward in automated optical inspection.”
The EAGLE 3D 8800 TWIN AOI uses 12-way projection on both sides for 3D measurements on all models to minimize errors due to shadow effects and performs 100% 2D & 3D concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. With the TWIN, Pemtron introduces Top/Bottom Double Sided simultaneous inspection. Pemtron’s new head type has been upgraded from the existing head for 3D formation that is identical to the real image and is more stable based on the accumulated technology for decades.
Established in 2006, the EM Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.