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Aven’s MicroVue 360 Viewer Attachment Offers Enhanced Precision and Comfort
April 19, 2023 | AvenEstimated reading time: Less than a minute
Aven, a full-service technology provider, is proud to announce the release of its latest innovation, the MicroVue 360 Viewer Attachment.
Designed for use with Aven’s line of MicroVue Digital Microscopes, the MicroVue 360 Viewer Attachment offers a range of benefits for users who require enhanced precision and comfort during their work. The 35-degree angled mirror is ideal for looking around multi-layered parts such as circuit boards, medical tools, industrial parts, and more.
One of the key features of the MicroVue 360 Viewer Attachment is its 360-degree rotation capability. This allows users to easily adjust the viewing angle to achieve the perfect line of sight, whether they're working with delicate electronic components or examining biological specimens.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Technica USA Partners with Creative Electron
10/22/2025 | Technica USATechnica USA is proud to announce the partnership with Creative Electron Inc. located in San Marcos, CA.
SCHMID Ships First InfinityLine P+ Panel-Level Plating System
10/08/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announced the shipment of its first InfinityLine P+ system – a newly developed panel-level plating equipment with integrated photoresist stripping.
Cadence Unveils AI-Driven ROCS X AI-Enabled Molecular Search, Unlocking Multi-trillion Molecule Virtual Screening
09/29/2025 | Cadence Design SystemsCadence Molecular Sciences (OpenEye), a business unit of Cadence, announced at miniCUP Boston, the launch of ROCS X, an AI-enabled virtual-- screening solution that allows scientists to conduct 3D searches of trillions of drug-like molecules.
SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
09/29/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
Understanding Signal Integrity, the Foundation of High-Speed Digital Design
09/25/2025 | Stephen V. Chavez, Siemens EDASignal integrity has become a critical factor in ensuring reliable performance in high-speed digital systems. As data rates continue to increase, engineers must understand the fundamental principles that govern how signals propagate through transmission lines and how to mitigate common issues that can degrade signal quality.