Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
IPC, IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
May 9, 2023 | IPCEstimated reading time: 1 minute
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.
The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.
Keynotes include:
- “CHIPS” presented by Eric Lin, U.S. Department of Commerce
- “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)
- “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
- “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team
The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging.
“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policy makers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Advanced Silicone Solutions from CHT
04/01/2025 | Real Time with...IPC APEX EXPOCHT team members introduce themselves and share their roles, with Kate Sincerbox focusing on technical service and Lisa Stutzman on inside sales. CHT specializes in silicone materials for encapsulation, adhesives, and coatings, serving the automotive and aerospace sectors.
Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
03/31/2025 | Real Time with...IPC APEX EXPONeil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
Real Time with... IPC APEX EXPO 2025: Koh Young—AI's Impact on the Electronics Industry
03/27/2025 | Real Time with...IPC APEX EXPOKoh Young's Joel Scutchfield discusses the role of AI in the electronics industry. He emphasizes data quality's importance for automation and the development of AI engines for specific tools. The conversation covers market trends in PCB and semiconductor technologies, trade negotiations, and the challenges of reshoring.
Real Time with... IPC APEX EXPO 2025: Kyzen—Enhancing PCB Cleaning Processes
03/26/2025 | Real Time with...IPC APEX EXPOJayson Moy of KYZEN discusses recent changes the company has made that are aimed at adding value to the industry. He highlights the significance of a reliable cleaning process for PCBs, which can prevent issues and boost efficiency.