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IPC, IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
May 9, 2023 | IPCEstimated reading time: 1 minute
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.
The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.
Keynotes include:
- “CHIPS” presented by Eric Lin, U.S. Department of Commerce
- “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)
- “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
- “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team
The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging.
“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policy makers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”
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