Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
IPC, IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
May 9, 2023 | IPCEstimated reading time: 1 minute
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.
The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.
Keynotes include:
- “CHIPS” presented by Eric Lin, U.S. Department of Commerce
- “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)
- “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
- “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team
The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging.
“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policy makers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”
Share on:
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
AMI Achieves 52 Consecutive Weeks of First Pass Yield Rates Above 98.72%
05/06/2025 | Alternative Manufacturing, Inc.AMI, a leading provider of high-quality PCB assembly (PCBA) solutions, proudly announces the achievement of 52 consecutive weeks of first pass yields at test, maintaining an exceptional success rate of 98.72% or better. This remarkable accomplishment underscores the company's unwavering commitment to manufacturing excellence, quality assurance, and customer satisfaction.
Alternative Manufacturing Inc. (AMI) Appoints Gregory Picard New Business Development Manager
05/01/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing Inc. (AMI) is pleased to announce the appointment of Mr. Gregory Picard as our new Business Development Manager. Picard brings a wealth of experience in Sales and Business Development, having worked with some of the most prominent names in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/25/2025 | Nolan Johnson, I-Connect007I’m highlighting a discussion on the positive potential coming from the recent changes in global trade policy—from IPC’s Government Relations team, and from TTM CEO Tom Edman. In the realm of designers and purchasers realm, there’s news from Screaming Circuits and ASC/Sunstone Circuits to share. Finally, additive manufacturing and the release of CFX 2.0 highlight just some of the news coming to the shop floor as well.
HEITEC Expands Deployment of Aegis Software’s FactoryLogix MES to Boost Sustainable Manufacturing
04/23/2025 | Aegis SoftwareAegis Software, a global provider of Manufacturing Execution System (MES) software, announces that HEITEC’s business unit Elektronik, a leading manufacturer of complex electronic solutions based in Eckental, Germany, is expanding its use of the FactoryLogix® MES platform to additional products.