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The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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June 2023 Issue of Design007 Magazine Available NowJune 8, 2023 | I-Connect007 Editorial Team
Estimated reading time: Less than a minute
Top Design Challenges
In this month’s Design007 Magazine, we share the top PCB design challenges from a variety of viewpoints—PCB designers, fabricators and assembly providers. The three challenges most often cited by contributors revolve around DFM, communication, and data—all of which are interrelated. We think you’ll find this compilation of design challenges useful.
Wondering why there is a tortoise on the cover of this issue? Well, if you recall one of the most popular Aesop’s Fables, The Tortoise and the Hare, the slow and steady reptile beat his much faster opponent by taking his time and persevering. Judging from what our expert contributors have to say in this issue, many PCB design problems could be precluded if designers simply took their time. (Yes, designers even called themselves out for this faux pas!)
iNEMI Packaging Tech Topic Series Webinar, LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design will be held on November 28, 2023, by guest speaker Kazunari Koga, Zuken Inc.
Keysight EDA Strengthens Design and Simulation Support for Tower Semiconductor RF Process Technologies11/16/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. expanded the simulation capabilities in its Electronic Design Automation (EDA) software suite to include electro-thermal simulation for the Tower Semiconductor SiGe Power Amplifier (PA) process.
William of Ockham was a significant figure in medieval philosophy who lived from 1285 to 1347 and was an English Franciscan friar, philosopher, and theologian. William of Ockham is most famously known for formulating the principle of Occam's Razor, also known as the principle of parsimony. In simple terms, Occam's Razor is a problem-solving rule suggesting that when you have multiple possible explanations, the simplest one is usually the best. The most straightforward solution that fits all the facts without adding extra assumptions or complications.
Albert Einstein said, “Everything should be made as simple as possible, but not simpler.” Whilst his words were aimed at those describing complex theory in the simplest way possible, but not so simplified that key information is lost—a process which the media is often criticised for as “dumbing down” information. However, from an engineering perspective, if a design can be engineered to perform the required application in a simpler or more economic way than previously then simplification is truly a valuable goal.
Cadence Design Systems, Inc. announced a collaboration with Autodesk to provide solutions that accelerate intelligent system design leveraging Autodesk Fusion and Cadence® PCB solutions.