-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Toyochem Develops Highly Flexible EMI Shielding Films for Smart Devices
June 9, 2023 | ToyochemEstimated reading time: 1 minute

Toyochem Co., Ltd., the polymer and coatings division of Japan’s Toyo Ink Group, has rolled out the new LIOTELAN line of highly flexible conductive and insulating sheet films for the protection of electrical and electronic equipment. The new sheet films exhibit high water-resistance and are highly flexible with a high elongation of 500 percent. LIOTELAN shielding films can be hot-press molded on to the electromagnetic interference (EMI) noise source on the printed circuit board (PCB), thus forming a lightweight multi-layer shield with a more compact format than a metal shielding can. The gives component engineers increased design freedom to create electronic devices of lower profiles and lighter weights – and without compromising shielding effectiveness. Potential applications are wearable devices, wireless communications and other smart devices.
Traditionally, metals are commonly adapted as EMI shields due to their shielding effectiveness. Looking to replace shielding metals, Toyochem engineers in Japan applied its own functional filler dispersion technology in the development of highly conductive fillers to improve EMI shielding performance. This development, and the application of Toyochem’s polymer sheet conversion technology, led to the creation of filler films that could be converted into flexible LIOTELAN sheet films with high shielding effect, water-resistance and mechanical durability.
Moreover, LIOTELAN sheets films are capable of fabricating multi-layer EMI shields by the hot-pressing method. “An insulating sheet layer can be hot-press molded directly over electronic components attached to the substrate. A conductive layer is formed over the insulating layer using the same method. With LIOTELAN shielding films, device engineers can easily and speedily create lightweight, durable and effective EMI shields, without the need for soldering or a bulky can cover,” explains Hidenobu Kobayashi, technical manager at Toyochem. “This new innovative product enables the formation of ultra-thin shielding laminates of high flexibility, conductivity and insulation properties required by next-generation PCBs. In line with rising demand for components of lighter weight, lower profiles, and more durable and flexible materials, we expect to see the trend towards metals being replaced by polymer composites to continue.”
The new LIOTELAN line of EMI shielding sheet films will be making its global debut at the Toyochem booth #1016 at the International Microwave Symposium in San Diego, California, from June 11–16, 2023. Toyochem will also feature its LIOELM™ TSS™ 500 series for next-generation high-speed communication devices among other high-performance materials designed to solve problems related to electromagnetic radiation and thermal conductivity.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SolderKing Marks Seven Years of Growth and International Recognition
10/01/2025 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating seven years of innovation, growth, and international success.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/25/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China.
Winners of Hand Soldering and Wire Harness Competitions Announced at NEPCON Vietnam 2025
09/24/2025 | Global Electronics AssociationIn conjunction with NEPCON Vietnam 2025, the Global Electronics Association hosted its popular Hand Soldering Competition on September 11–12, 2025, and the Northen regional round of the Wire Harness Competition on September 10, 2025, in Hanoi, Vietnam.
Meet the Author Podcast Features Dr. Pritha Choudhury
09/24/2025 | I-Connect007I-Connect007 announces the latest episode of its Meet the Author podcast series, spotlighting Dr. Pritha Choudhury, a co-author of The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2. In this conversation with SMT007 Managing Editor Nolan Johnson, Dr. Choudhury explains why a second volume was essential and explores the real-world factors accelerating the adoption of low-temperature soldering across the electronics manufacturing industry.