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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 9, 2023 | Andy ShaughnessyEstimated reading time: 2 minutes
It’s summertime, but the industry is staying pretty busy. This week, we have news about our industry putting pressure on our elected officials to provide funding for U.S. companies under the CHIPS Act, and a counterfeit parts symposium presented by SMTA in Maryland next month. We also bring you articles about ultra HDI design and material selection, and our most recent On the Line with… podcast with Zac Elliott of Siemens.
Next week, it looks like San Diego is the place to be as the International Microwave Symposium kicks off June 11 at the San Diego Convention Center. Our own Barry Matties and Nolan Johnson will be at the show all week, and our good friends Ventec, American Standard Circuits, Rogers and more will be exhibiting there. Don’t miss out.
Electronics Industry Leaders Call on Congress to Support $100M in PCB Sector Funding
Published June 6
Sure, the CHIPS Act is a step in the right direction, but we as an industry have to hold Congress’s feet to the fire. This letter from executives from 26 electronics manufacturers across the U.S. is a step in the right direction. It’s an election year, so our senators and representatives might be more amenable to our ideas than during an off year.
NASA to Keynote the Symposium on Counterfeit Parts & Materials
Published June 6
Counterfeit parts are a continuing problem in our industry. SMTA is hosting the Counterfeit Parts & Materials Symposium June 27–29 near my hometown in Hyattsville, Maryland, and NASA’s Dr. Peter Majewicz is presenting the keynote. If you’re in the defense sector, this is right in your wheelhouse.
Sustainability in Logistics Discussion Continues
Published June 7
This week, we dropped a new “pod,” as the kids say, continuing our conversation with Siemens Technical Marketing Engineer Zac Elliott. In this installment, Zac explains how logistics, done improperly, can create waste downstream in a variety of ways. Managing Editor Nolan Johnson has proven to be the breakout podcast star.
A Focus on Ultra HDI
Published June 5
John Johnson just joined American Standard Circuits, and he’s bringing along his expertise in ultra HDI. In this interview with Barry Matties, he shares his thoughts on these tiny traces and his plans for moving ASC forward in the ultra HDI realm.
Slash Sheets: Don’t Fall Into the Trap
Published June 8
When you’re selecting materials for a design, what documents do you consult? In this article from Geoffrey Hazelett, he explains why designers shouldn’t use IPC slash sheets in their material selection process, and he offers his thoughts on the best way to find the right laminate for your job.
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Brent Fischthal - Koh YoungSuggested Items
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.