Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
IEEE IMS Show: A High-Speed Designer’s Paradise
June 14, 2023 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
The IEEE International Microwave Symposium is underway this week at the San Diego Convention Center, and the I-Connect007 team is on site for the opening of the exposition.
For a PCB designer or design engineer, virtually all the sources for board raw materials were present on the show floor: semiconductors, board material suppliers, fabricators, design bureaus, design tool vendors, EMS equipment manufacturers, solder, and more. Given that this is a microwave symposium, nearly all the exhibitors had a high-speed, RF story to share. RF and high-speed design challenges are in the forefront of everyone’s thinking this week.
The show floor had steady traffic throughout opening day. With 500+ exhibitors, attendees seemed to spread out rather evenly throughout the hall. Exhibitors and attendees alike seemed pleased with the amount of activity on the expo floor.
Elsewhere at the convention center, the technical sessions seemed to be enthusiastically attended. While sessions may have tackled wide-ranging topics, the general trend fell into seven categories:
- Wireless Communications
- Future Directions: Artificial Intelligence (AI)/Machine Learning (ML)
- Connected Future Summit
- Model Based Systems Engineering (MBSE)
- Space
- Wireless Power Transfer
- Biomedical
The symposium technical conference runs from June 11-16. The exposition is June 13-15.
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