-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
PCB Design Challenges—From the Fabricator’s Viewpoint
June 22, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

If you’re a fabricator, chances are you have a few things to say about at least a few of the PCB designs that make their way through your shop. I guarantee that you have several well-worn stories about designs that made you scratch your head and think, “Hmmmm.”
So, in this section, we asked PCB fabrication experts to share their thoughts about challenges that PCB designers need to more thoroughly understand. Do you see yourself on either side of these issues?
Dana Korf - Korf Consultancy LLC
What is your main concern for PCB designers?
Impedance and signal loss variability. In recent years the signal integrity that RF designers were very concerned about is now becoming a requirement in standard digital and analog designs. Simulation tools are used to characterize the design nominally and against high and low tolerances of the key specifications. Then a quick prototype is fabricated and tested. Several iterations may be built and assembled until the proper answer is achieved.
The signal performance can be affected by the drilled/lased hole’s inner diameter, plated diameter, material dielectric thickness and electrical properties, solder mask, Dk and thickness, trace-width tolerance, and to a lesser extent its thickness. Yet, the fabricator is rarely required to provide this information to the designer. So, the designer doesn’t know if the PCB was built at the high-end, low-end, or middle of the tolerance range. Designers often complain that a new revision or build didn’t perform like the last version. Of course, it may not. The reason is most likely due to fabrication tolerances.
When the design has tight impedance or loss requirements the designer should require more information about the received PCB critical parameters to better correlate actual performance to the expected performance.
What issue should PCB designers be more aware of?
Over-specification. Significant cost is incurred by over-specifying requirements. One of the most common reasons for this is that requirements get copied from one design to another design without the designer’s full understanding of whether they are applicable. Another reason is that PCB hardware engineers and designers are not sufficiently taught about cost impacts early in their career. For instance, how many PCB fabrication classes are taught at trade schools, community colleges, and four-year universities?
Continue reading the rest of this article in the June 2023 issue of Design007 Magazine.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.