Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
EIPC Summer Conference 2023: Day 1 Review
June 28, 2023 | Pete Starkey, I-Connect007Estimated reading time: 14 minutes
Automotive Radar Applications
The development of a stable dielectric performance and low modulus copper-clad laminate for automotive radar applications was described by Yonghyon Kim, senior engineer with Doosan Corporation Electro-materials.
He reviewed the technological trend for radar sensors and the laminate requirements for automotive radar operating at 77–79 GHz frequencies. To minimise mechanical stress, a low-modulus material is necessary, and he described a filled fluoroplastic material without woven glass reinforcement. This gives advantages in mechanical drilling together with dielectric uniformity and CAF-resistance as well as outstanding high-frequency performance, making it an excellent choice for automotive radar applications.
Kim gave a comprehensive list of material properties and examples of reliability test results, particularly heat aging and thermal cycling.
He concluded by demonstrating that the mega-trend toward smart mobility will necessitate hyper-connectivity and convergence in a whole series of industries, and described the range of copper-clad laminate material solutions offered by Doosan.
Conclusion
At the end of the day’s conference proceedings, we took a short bus journey to BMW World, where we saw many shiny motor cars, BMW, Mini, and Rolls Royce, and some desirable motorcycles, as well as learning about thousand-dollar umbrellas and hand-painted coach-lines.
In the evening, we took the bus downtown to a traditional Bavarian restaurant overlooking the opera house Spatenhaus an der Oper, for a splendid networking dinner.
Note: My thanks to Alun Morgan for the excellent photographs.
Links to other articles in this three-part series:
Page 3 of 3
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.