-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
KYZEN to Showcase PCB and Stencil Cleaning Products at SMTA Querétaro
June 30, 2023 | KyzenEstimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 13, 2023, in Juriquilla-Querétaro in the EXPO HALL of Hotel Misión Juriquilla. The KYZEN clean team will showcase products for cleaning PCBs in AQUANOX A4626 paired with the KYZEN Process Control System (PCS) and understencil wipe KYZEN E5631J.
Though utilized in different phases of PCB assembly, both solutions are formulated with cleaning efficiency and effectiveness as priorities and ease of use in mind.
AQUANOX A4626 is a concentrated aqueous cleaning agent with a wide material compatibility window on boards, components, labels and metallic surfaces. This next generation chemistry is designed to provide superior results in cleaning traditional lead-free and eutectic tin-lead residues in addition to the latest polymetric no-clean fluxes.
The KYZEN Process Control System (PCS) is designed to automatically track your wash bath concentration by adding just the right amount of chemistry when needed. For more than 20 years, KYZEN has continuously improved and advanced the capabilities of KYZEN PCS, so it continues to excel in alleviating stress on users by controlling, monitoring and automatically reacting to dynamic changes in wash bath concentrations.
KYZEN E5631J is a ready-to-use solution for removing raw solder paste from stencils formulated with great consideration for workers and the environment. This cost-effective solution quickly and effectively cleans all types of raw solder pastes in both online and offline cleaning processes.
KYZEN products and cleaning experts remain focused on providing quality chemistries like AQUANOX A4626 and KYZEN E5631J, along with control systems like the KYZEN PCS to assist the cleaning needs of PCB producers at every stage of their production process.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.