Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
Flexible Thinking: Musings on High Density Interconnections
Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators
Indium Corporation Earns IEEE Outstanding Industry Award for Innovative Solder Preforms
July 6, 2023 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS® brand of reinforced solder preforms. The award was presented during a ceremony on June 24 in Kuala Lumpur, Malaysia.
The Outstanding Industry Awards recognize outstanding achievements and unwavering commitment in providing advanced materials and innovative solutions.
InFORMS® are reinforced solder preforms that provide improved strength and a more consistent bondline thickness, which maximizes the thermal and mechanical reliability of the solder joint. InFORMS® can be manufactured in a wide variety of shapes, including rectangles and discs, as well as custom shapes to suit specific application requirements. They also come in the form of ribbon for automated assembly.
“As an advanced materials innovator, our belief that materials science can change the world is present in every one of our products,” said Senior Country Sales Manager, Malaysia Damian Santhanasamy. “We are honored to have InFORMS® recognized by IEEE Malaysia Section for its innovative ability to reduce costs by maintaining uniform bondline thickness.”
Share on:
Suggested Items
KYZEN to Feature Understencil and PCB Cleaners at SMTA Tijuana
10/28/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Tijuana Expo & Tech Forum, scheduled to take place Thursday, November 7, at Quartz Hotel Tijuana.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Space Coast Expo & Tech Forum
10/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Space Coast Expo & Tech Forum taking place on November 14 at the Melbourne Auditorium in Melbourne, Florida.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
10/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
All Flex Solutions Invests in Assembly Inspection Automation
10/17/2024 | All Flex SolutionsAll Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
TopLine to Exhibit 'Drop-in Replacement' for BGA at Electronica
10/16/2024 | TopLineTopLine Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428.