Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Fresh PCB Concepts: PCB Plating Process Overview
Indium Corporation Earns IEEE Outstanding Industry Award for Innovative Solder Preforms
July 6, 2023 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS® brand of reinforced solder preforms. The award was presented during a ceremony on June 24 in Kuala Lumpur, Malaysia.
The Outstanding Industry Awards recognize outstanding achievements and unwavering commitment in providing advanced materials and innovative solutions.
InFORMS® are reinforced solder preforms that provide improved strength and a more consistent bondline thickness, which maximizes the thermal and mechanical reliability of the solder joint. InFORMS® can be manufactured in a wide variety of shapes, including rectangles and discs, as well as custom shapes to suit specific application requirements. They also come in the form of ribbon for automated assembly.
“As an advanced materials innovator, our belief that materials science can change the world is present in every one of our products,” said Senior Country Sales Manager, Malaysia Damian Santhanasamy. “We are honored to have InFORMS® recognized by IEEE Malaysia Section for its innovative ability to reduce costs by maintaining uniform bondline thickness.”
Share on:
Suggested Items
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.