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KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
April 16, 2025 | KOKIEstimated reading time: Less than a minute
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Solder voiding is a persistent issue in electronic assembly, often impacting the reliability and performance of solder joints. While some degree of voiding is considered acceptable depending on the application, excessive voids can significantly compromise mechanical strength, electrical continuity, and thermal dissipation. In this webinar, McIntyre will explore the root causes of solder voiding and discuss key factors that influence void formation. Attendees will gain valuable insights into how material selection and process adjustments can help reduce voids and improve overall solder joint quality.
Designed for engineers, manufacturers, and industry professionals, this session offers practical strategies for optimizing soldering processes and ensuring greater product reliability.
Registration is now open.
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