-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Siemens Advances Intelligent Custom IC Verification Platform with New, AI-powered Solido Design Environment
July 10, 2023 | SiemensEstimated reading time: 3 minutes
Siemens Digital Industries Software introduced Solido™ Design Environment software – an artificial intelligence (AI)-powered, cloud-ready integrated circuit (IC) design and verification solution that can help design teams meet and exceed increasingly aggressive power, performance, yield and reliability requirements while helping to dramatically speed time to market.
IC engineering teams must increasingly adapt to a new era of substantially higher design complexity driven by demand for compelling, highly differentiated applications across industries including wireless, automotive, high-performance computing (HPC), and internet-of-things (IoT). Siemens’ new Solido Design Environment software has been developed to help circuit designers address this challenge, delivering a unified approach for custom IC design and verification that can help designers to achieve high overall design quality and reduce time-to-market, while optimizing for these inter-dependent tradeoffs.
The newest addition to Siemens’ intelligent custom IC verification platform, the Solido Design Environment software, features AI technology and cloud deployment readiness. The Solido Design Environment software provides a single, comprehensive cockpit that handles nominal and variation-aware analysis, including SPICE-level circuit simulation setup, measurements and regressions, as well as waveforms and statistical results analysis.
Using AI technology, the solution can help users identify optimization paths to improve circuit power, performance, and area, as well as to perform production-accurate statistical yield analysis at a fraction of runtime compared to brute-force methods. It also features new Additive Learning technology that assists in significantly boosting performance for design and verification teams, producing smarter and faster AI decisions and analysis using retained AI models. With these advanced capabilities, the Solido Design Environment software can help to achieve verification accuracy up to 6 sigma and higher yield at speeds orders of magnitude faster than brute-force Monte Carlo, while helping to significantly improve coverage and accuracy.
“Semiconductor content is growing dramatically in a multitude of applications,” said Amit Gupta, vice president and general manager of the Custom IC Verification division at Siemens Digital Industries Software. "Engineering teams must adapt to higher design complexity and increasing variation effects, while meeting power, performance, area, and yield targets. With cutting-edge AI technology for signoff variation analysis seamlessly integrated into an intelligent, cloud-ready design environment, Solido Design Environment software represents a breakthrough for custom IC design, providing disruptive advantages for standard cell, memory, and analog IP design teams.”
Early customers are experiencing significant benefits. Using the new solution, SK hynix Inc., a top tier global provider of advanced memory and sensor technologies, significantly reduced the time it takes for them to go from initial design to production. “Verification accuracy and turnaround time are key factors in our design flow, as we create the next generation of memory technology,” said Mr. Do Chang-Ho, head of Computer Aided Engineering at SK hynix. “Siemens’ Solido Design Environment software has delivered brute force-accurate variation analysis coupled with powerful and easy-to-use design optimization, which has significantly reduced the time it takes for us to go from initial design to production.”
Other industry leaders on Solido Design Environment
“The Solido Design Environment software is a clear example of how Siemens EDA listens to their users and develops solutions that empower users to achieve better results,” said Sam Bagwell, director of US Design Services for Forza Silicon (AMETEK, Inc.). “Our designers use Solido Design Environment software as their simulation environment when custom designing state-of-the-art, low-noise, high-resolution, ultra-high speed CMOS image sensors for a wide range of applications including cinematography, machine vision, automotive, AR/VR, and more. We have had an outstanding experience with the solution, due to its productivity-boosting design workflows, intuitive results visualization, and excellent user support.”
“We have been using the Solido Design Environment software in our production custom design methodology, and it has exceeded our expectations,” said Patrick Camilleri, co-founder and vice president of Engineering at Crypto Quantique. “Thanks to the solution’s flexibility to adapt to our use models, we were able to integrate it into our existing methodology with ease and take advantage of its tool-assisted workflow capabilities to boost our design efficiency.”
“Solido Design Environment’s variation-aware verification capabilities have significantly benefited our design flow," said Randy Caplan, chief executive officer for Silicon Creations. "Its ability to quickly and accurately identify potential issues at high sigma, as well as to provide insights on optimizing our designs to work at a high degree of robustness, have been helpful to designers as we continue to provide world-class design IP to our customers.”
Suggested Items
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.
DesignCon 2025: Looking Great at 30
01/30/2025 | Andy Shaughnessy, Design007DesignCon may be turning 30 this year, but the Silicon Valley staple doesn’t look a day over 25. Attendees turned out for this celebratory bash, many of them reminiscing about their first DesignCon event 20 or 30 years ago. The Tuesday night welcome reception was basically a 30th birthday bash, sponsored by Mouser. Show managers went all out, with strobe lights and a DJ blasting a mix of old and new dance tunes. That was fitting, because I spoke with engineers from ages 21 to 81 at DesignCon this year. Nice to see more younger folks each year.
Istvan Novak Looks Back on History of DesignCon
01/29/2025 | Andy Shaughnessy, Design007 MagazineMany of us have been attending DesignCon for a long time, but Samtec’s Istvan Novak has been attending DesignCon even before it was called DesignCon. A veteran signal and power integrity engineer, Istvan has been on the Technical Program Committee for over two decades, and he’s authored and co-authored a variety of award-winning conference papers. In honor of the show’s 30th anniversary, I asked Istvan to share a little about the early years of DesignCon, and how he got involved with the event.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
01/29/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
SMTA UHDI Symposium 2025, Part 2: State of the Art
01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.