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Ansys Enables Flexium's 5G mmWave Antenna Module Designs to Advance ADAS/AV Technology
July 13, 2023 | PRNewswireEstimated reading time: 1 minute

Flexium uses Ansys simulation solutions to explore design ideas, and develop and test antenna modules for high-frequency signal transceiver designs used in advanced driver assistance systems (ADAS) and autonomous vehicle (AV) applications. With support from Ansys tools, the printed circuit board (PCB) manufacturer's R&D team can also test the durability and reliability of its PCB boards, as well as explore new design ideas through layout and material experimentation at a relatively low cost.
Within Flexium's PCB layouts are numerous flexible print circuits (FPCs) responsible for critical connections that enable 5G communication in ADAS and AV applications. Any design deficiencies within these layouts can negatively impact FPC transmission characteristics responsible for vehicle perception.
To address these challenges, Flexium uses Ansys simulation software for the electromagnetic, thermal, and mechanical optimization of its FPC designs through efficient layout and material changes. Ansys tools also helped Flexium set specific parameters for board layout and materials, then create a reference library for future mmWave design verification.
"Ansys delivers the greatest predictive accuracy and yields the strongest results for us during PCB layout analysis critical to today's ADAS and AV applications," said Ming-Chi Cheng, president of Flexium. "Looking beyond 5G, we will continue to reference Ansys simulation to discover new methods for optical integration and communication that will help shape the future of our mmWave antenna module designs."
"With Ansys, global PCB industry leaders like Flexium realize the freedom to explore possibilities in board application design, and successfully develop forward-thinking antenna solutions for high-frequency signal transceiver applications," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "As the momentum behind miniaturization continues to build, our simulation solvers will accelerate the satellite, driverless, and related wireless signal modules powering this trend."
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New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
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The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.