-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
USI Empowers Smart Cockpit System Innovation with Excellent Modular Design Capability
July 21, 2023 | USIEstimated reading time: 3 minutes

With the booming development of electric vehicles and advanced driver-assistance systems, the automotive industry is entering a rapidly evolving era of smart driving. To enhance performance and passenger experience, numerous automakers are actively incorporating cutting-edge electronic devices and technologies, striving to achieve more advanced driver's cockpit systems. In this flourishing field, USI is collaborating with multiple automotive SoC solution providers (TP) to accelerate the development of smart cockpit systems by leveraging its years of expertise in System-in-Package (SiP) and System-on-Module (SoM) modules, effectively reducing the size of automotive compute modules while ensuring the highest operational speed of DDR.
Modern smart cockpit systems have evolved beyond limited infotainment functions such as CD players, USB, and Bluetooth connectivity. They now encompass a wide range of rich features, including passenger entertainment displays, panoramic assistance displays, heads-up displays, digital instrument clusters, driver detection, passenger detection, voice-controlled temperature adjustment, voice-controlled music playback, and message transmission. These advancements allow drivers to experience a prestigious cockpit similar to that of an aircraft, greatly enhancing driving comfort, improving handling performance, and reducing driver fatigue.
Smart cockpit systems not only fulfill the role of a mobile personal entertainment center but also continuously innovate in line with the evolving trends of artificial intelligence (AI) assistance, advanced connectivity (C-V2X), advanced driver-assistance systems (ADAS), and software-defined vehicles (SDV). These trends will further drive the development of smart cockpit systems in the following application scenarios:
Intelligent Human-Machine Interface: Touchscreen interfaces have become the mainstream method of interaction today. However, in the future, with the gradual integration of artificial intelligence (AI) assistance, traditional physical touchscreens may gradually be replaced by advanced voice control, gesture control, and even eye-tracking control.
Diversified Cabin Functions: The future smart cockpit will integrate fully autonomous driving technology and become a versatile center for smart office and entertainment. Drivers and passengers will be able to engage in office work, meetings, multimedia entertainment, and other activities within the vehicle cabin.
Based on these development trends, it is evident that there will be a significant increase in market demand for System-on-Chips (SoCs) and active/passive electronic components. With the improvement in CPU processing speed and the expansion of functionalities, using traditional chip-on-board solutions would require mainboards to transition to high-density interconnect (HDI) PCBs with 10 or more layers. However, modular design can reduce motherboard PCB stack-up and design complexity.
USI adopts advanced underfill, BGA (Ball Grid Array) mounting, embedded passive components, and high-density SMT (Surface Mount Technology) process technology to develop automotive compute modules. These modules encompass crucial control components such as System-on-Chips (SoCs), dynamic random-access memory (DDR), and power management integrated circuits (PMICs), which are independent of the mainboard. This modular design reduces the mainboard's footprint and enhances computational performance, including processing speed and power distribution network performance, thereby improving the quality and efficiency of the smart cockpit system. Simultaneously, carmakers can focus on mainboard development, reducing overall development time and saving on research and development costs. Furthermore, the adoption of automotive compute modules can lower the mainboard's cost for manufacturers and facilitate the implementation of high-density PCB designs within smaller module areas.
USI has been dedicated to driving innovation in automotive technology and has extensive experience in the development of automotive compute module products. The company can provide a wide range of high-quality advanced automotive compute modules, delivering a safer, more convenient, and exciting driving experience for drivers and passengers of new-generation vehicles. USI's solutions not only offer comprehensive technical support to automotive manufacturers but also achieve improvements in product quality and performance, reduce development time, and lower research and development costs.
As the market for smart cockpit systems continues to evolve, USI will continue to lead the automotive industry into this new era, injecting strong momentum into the intelligent development of the future automotive industry.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.