-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
USI Empowers Smart Cockpit System Innovation with Excellent Modular Design Capability
July 21, 2023 | USIEstimated reading time: 3 minutes

With the booming development of electric vehicles and advanced driver-assistance systems, the automotive industry is entering a rapidly evolving era of smart driving. To enhance performance and passenger experience, numerous automakers are actively incorporating cutting-edge electronic devices and technologies, striving to achieve more advanced driver's cockpit systems. In this flourishing field, USI is collaborating with multiple automotive SoC solution providers (TP) to accelerate the development of smart cockpit systems by leveraging its years of expertise in System-in-Package (SiP) and System-on-Module (SoM) modules, effectively reducing the size of automotive compute modules while ensuring the highest operational speed of DDR.
Modern smart cockpit systems have evolved beyond limited infotainment functions such as CD players, USB, and Bluetooth connectivity. They now encompass a wide range of rich features, including passenger entertainment displays, panoramic assistance displays, heads-up displays, digital instrument clusters, driver detection, passenger detection, voice-controlled temperature adjustment, voice-controlled music playback, and message transmission. These advancements allow drivers to experience a prestigious cockpit similar to that of an aircraft, greatly enhancing driving comfort, improving handling performance, and reducing driver fatigue.
Smart cockpit systems not only fulfill the role of a mobile personal entertainment center but also continuously innovate in line with the evolving trends of artificial intelligence (AI) assistance, advanced connectivity (C-V2X), advanced driver-assistance systems (ADAS), and software-defined vehicles (SDV). These trends will further drive the development of smart cockpit systems in the following application scenarios:
Intelligent Human-Machine Interface: Touchscreen interfaces have become the mainstream method of interaction today. However, in the future, with the gradual integration of artificial intelligence (AI) assistance, traditional physical touchscreens may gradually be replaced by advanced voice control, gesture control, and even eye-tracking control.
Diversified Cabin Functions: The future smart cockpit will integrate fully autonomous driving technology and become a versatile center for smart office and entertainment. Drivers and passengers will be able to engage in office work, meetings, multimedia entertainment, and other activities within the vehicle cabin.
Based on these development trends, it is evident that there will be a significant increase in market demand for System-on-Chips (SoCs) and active/passive electronic components. With the improvement in CPU processing speed and the expansion of functionalities, using traditional chip-on-board solutions would require mainboards to transition to high-density interconnect (HDI) PCBs with 10 or more layers. However, modular design can reduce motherboard PCB stack-up and design complexity.
USI adopts advanced underfill, BGA (Ball Grid Array) mounting, embedded passive components, and high-density SMT (Surface Mount Technology) process technology to develop automotive compute modules. These modules encompass crucial control components such as System-on-Chips (SoCs), dynamic random-access memory (DDR), and power management integrated circuits (PMICs), which are independent of the mainboard. This modular design reduces the mainboard's footprint and enhances computational performance, including processing speed and power distribution network performance, thereby improving the quality and efficiency of the smart cockpit system. Simultaneously, carmakers can focus on mainboard development, reducing overall development time and saving on research and development costs. Furthermore, the adoption of automotive compute modules can lower the mainboard's cost for manufacturers and facilitate the implementation of high-density PCB designs within smaller module areas.
USI has been dedicated to driving innovation in automotive technology and has extensive experience in the development of automotive compute module products. The company can provide a wide range of high-quality advanced automotive compute modules, delivering a safer, more convenient, and exciting driving experience for drivers and passengers of new-generation vehicles. USI's solutions not only offer comprehensive technical support to automotive manufacturers but also achieve improvements in product quality and performance, reduce development time, and lower research and development costs.
As the market for smart cockpit systems continues to evolve, USI will continue to lead the automotive industry into this new era, injecting strong momentum into the intelligent development of the future automotive industry.
Suggested Items
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Accenture Acquires SYSTEMA to Drive Manufacturing Automation for Semiconductor Clients
07/02/2025 | AccentureAccenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.