-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TRI Introduces New AOI - TR7700 SIII Ultra
August 22, 2023 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new AOI TR7700 SIII Ultra.
The TR7700 SIII Ultra achieves remarkable speeds of up to 60 cm²/sec. The High-Speed AOI incorporates advanced AI algorithms, TRI's Smart Programming, and Metrology Measurements for unmatched inspection coverage and precision.
The TR7700 SIII Ultra addresses the industry's need for unprecedented efficiency without compromising accuracy. The advanced mechanical platform guarantees stability, accuracy, and precision during every inspection cycle. The newly released AOI is also offered in a Dual Lane configuration (TR7700 SIII Ultra DL), further expanding its capabilities to enhance productivity in high-speed inspection scenarios.
Seamlessly integrated into Smart Factories, the TR7700 SIII Ultra empowers data-driven decisions and heightened efficiency through real-time SPC trends. The TR7700 SIII Ultra supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
Suggested Items
Vertical Aerospace Adopts Universal Fast-Charging Standard to Accelerate eVTOL Deployment
04/01/2025 | BUSINESS WIREVertical Aerospace (Vertical), a global aerospace and technology company that is pioneering electric aviation, announces it will adopt the Combined Charging Standard (CCS) for the VX4, joining BETA Technologies and Archer Aviation in driving a universal, fast-charging system for electric vertical take-off and landing (eVTOL) aircraft.
Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
03/31/2025 | Real Time with...IPC APEX EXPONeil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.
New Accenture Siemens Business Group to Reinvent Engineering and Manufacturing for Clients
03/31/2025 | BUSINESS WIRESiemens and Accenture are significantly advancing their long-standing alliance partnership to help clients reinvent and transform engineering and manufacturing.
DuPont’s Nora Radu Receives American Chemical Society’s Distinguished Service Award for the Advancement of Inorganic Chemistry
03/31/2025 | DuPontDuPont announced that Nora Radu, Ph.D., DuPont Senior Laureate, has received the 2025 American Chemical Society (ACS) Award for Distinguished Service in the Advancement of Inorganic Chemistry, marking a historical milestone as the first industrial scientist to achieve this prestigious honor since the award was established in 1963.
Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
03/28/2025 | ROHMMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.