-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TRI Introduces New AOI - TR7700 SIII Ultra
August 22, 2023 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new AOI TR7700 SIII Ultra.
The TR7700 SIII Ultra achieves remarkable speeds of up to 60 cm²/sec. The High-Speed AOI incorporates advanced AI algorithms, TRI's Smart Programming, and Metrology Measurements for unmatched inspection coverage and precision.
The TR7700 SIII Ultra addresses the industry's need for unprecedented efficiency without compromising accuracy. The advanced mechanical platform guarantees stability, accuracy, and precision during every inspection cycle. The newly released AOI is also offered in a Dual Lane configuration (TR7700 SIII Ultra DL), further expanding its capabilities to enhance productivity in high-speed inspection scenarios.
Seamlessly integrated into Smart Factories, the TR7700 SIII Ultra empowers data-driven decisions and heightened efficiency through real-time SPC trends. The TR7700 SIII Ultra supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
11/22/2024 | Dan Feinberg, I-Connect007In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
Beyond Design: High-speed Rules of Thumb
11/21/2024 | Barry Olney -- Column: Beyond DesignThe idiom “rule of thumb” is often used in electronics design and has its origins in the practice of measuring roughly with one’s thumb. Rules of thumb are easy-to-remember, broadly accurate guides or principles based on practice rather than theory. They are used to help feed our intuition to find a quick solution based on experience. We are often forced to use rules of thumb in PCB design in the absence of expensive analysis tools. We also use them to get quick ballpark figures initially and then fine-tune the numbers with further analysis. We can use rules of thumb as a sanity check to assess whether we are using our tools correctly. In this month’s column, I will present some commonly used and helpful rules for high-speed PCB design.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
All Flex Solutions Adds Talent to Flexible Circuit Facilities
11/14/2024 | All Flex SolutionsAll Flex Solutions is excited to welcome John Letourneau as our Director of Facilities and Maintenance at our Flexible Circuit Centers of Excellence!