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IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman

11/22/2024 | Dan Feinberg, I-Connect007
In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.

Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets

11/21/2024 | Keysight Technologies
Keysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.

Beyond Design: High-speed Rules of Thumb

11/21/2024 | Barry Olney -- Column: Beyond Design
The idiom “rule of thumb” is often used in electronics design and has its origins in the practice of measuring roughly with one’s thumb. Rules of thumb are easy-to-remember, broadly accurate guides or principles based on practice rather than theory. They are used to help feed our intuition to find a quick solution based on experience. We are often forced to use rules of thumb in PCB design in the absence of expensive analysis tools. We also use them to get quick ballpark figures initially and then fine-tune the numbers with further analysis. We can use rules of thumb as a sanity check to assess whether we are using our tools correctly. In this month’s column, I will present some commonly used and helpful rules for high-speed PCB design.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

All Flex Solutions Adds Talent to Flexible Circuit Facilities

11/14/2024 | All Flex Solutions
All Flex Solutions is excited to welcome John Letourneau as our Director of Facilities and Maintenance at our Flexible Circuit Centers of Excellence!
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