Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Jabil Enters into Preliminary Agreement with BYD Electronic
August 28, 2023 | Jabil Inc.Estimated reading time: Less than a minute
Jabil Inc. announced a preliminary agreement with BYD Electronic (International) Company Limited (BYDE) relating to the sale of its Mobility business in a potential transaction expected to be valued at approximately $2.2 billion.
"This transformational deal would represent the largest transaction in the history of our company, and I am thrilled to be able to work with a reputable company like BYDE to drive this business successfully forward,” said CEO Kenny Wilson.
“If completed, the proceeds from this transaction will enable us to enhance our shareholder-centric capital framework, including incremental share buybacks. Additionally, it will provide opportunities for further investment in electric vehicles, renewable energy, healthcare, AI cloud data centers, and other end-markets," he added.
As part of the agreement, the parties have agreed to endeavor to enter into a definitive agreement. The divestiture will not be completed until the parties have completed due diligence and executed a definitive agreement and closed the transaction, which will be subject to the satisfaction of required regulatory approvals and other customary closing conditions.
Share on:
Suggested Items
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
Gartner Forecasts MENA IT Spending to Grow 7.4% in 2025
11/20/2024 | Gartner, Inc.IT spending in the Middle East and North Africa (MENA) region is projected to total $230.7 billion in 2025, an increase of 7.4% from 2024, according to the latest forecast by Gartner, Inc.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
New Ultrafast Memory Boosts Intel Data Center Chips
11/19/2024 | IntelWhile Intel’s primary product focus is on the processors, or brains, that make computers work, system memory (that’s DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen).
Sluggish Telecom Market Growth Prompts Operators to Become Full-Stack Technology Suppliers
11/18/2024 | IDCWorldwide spending on telecommunications and pay TV services will reach $1,544 billion in 2024, representing an increase of 2.4% year-on-year, according to the Worldwide Semiannual Telecom Services Tracker published by International Data Corporation (IDC).