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BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

01/02/2025 | I-Connect007
In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.

Connect the Dots: Designing for Reality—Solder Mask and Legend

01/02/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.

Global PCB Connections: Following DFM Rules Leads to Better Boards

12/18/2024 | Jerome Larez -- Column: Global PCB Connections
As a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.

Sayonara to the Last Standing Copper Foil Plant in North America

12/17/2024 | Marcy LaRont, I-Connect007
In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.

SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

12/16/2024 | SCHMID Group
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
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