-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Zuken Unveils CR-8000 2023 with Enhanced Design Efficiency, Analysis for High-Density, High-Speed PCB Designs
August 30, 2023 | ZukenEstimated reading time: 3 minutes

Zuken, a global leader in electronic design automation solutions, announces the availability of CR-8000 2023. The 2023 release is packed with new enhancements covering the entire design process and will empower users and enable them to tackle the challenges of high-density, high-speed PCB designs.
Notably, the CR-8000 2023 release places special emphasis on revitalizing and expanding the spectrum of signal integrity, power integrity, and electromagnetic compatibility (EMC) analysis tools. These advancements are seamlessly integrated into the CR-8000 Design Force Analysis Advance bundle, offering an unparalleled avenue for enhanced design insights.
"We are excited to unveil CR-8000 Release 2023, which empowers designers to address the ever-increasing demands of high-density, high-speed PCB designs," said Kazuhiro Kariya, Sr. Managing Executive Officer and CTO of Zuken Inc. "Through the strategic enhancements made to our flagship CR-8000 tool suite, we are providing our customers with a comprehensive solution that boosts design efficiency and supports accurate analysis, ultimately enabling them to stay ahead in today's competitive market."
Empowering Engineers with Advanced Design Creation
Streamlined Design Sheet Integration
With the CR-8000 2023 release, the process of generating new designs becomes a seamless journey. Users can effortlessly merge sheets from diverse designs, enabling the incorporation of various elements or the utilization of template designs as a solid foundation. This innovative feature fosters creativity and accelerates the design timeline.
Enhanced Information Security
Privacy takes center stage with the introduction of a resourceful feature that allows sensitive information exclusion before external sharing. Tailoring resource files to distinct collaboration needs fosters a secure and collaborative design environment.
Efficiency through Design Reuse
The 2023 release introduces a groundbreaking feature that streamlines documentation by enabling the copying, editing, and seamless integration of circuits and text elements. This innovation enhances efficiency by eliminating redundant tasks and allows engineers to focus on design evolution.
Expanded Design Efficiencies in Layout
Reuse Template Routing
Identical areas of components and routing that are common in multi-channel designs can now be placed and routed based on one instance. This function recognizes component and topology similarities and propagates the master instance to the subsequent channels.
Expanded Contour Routing
An interactive contour routing feature aligns seamlessly with existing patterns and board shapes, ensuring design harmony and consistency.
Analyze Track Configurations
Users can examine the routing of a trace path by visualizing a cross-sectional view that showcases the trajectory across various layers. This capability allows for comprehensive inspection and evaluation of track arrangements, aiding in identifying potential issues and optimizing the design.
Powerful Analysis Capabilities
Enhanced Bundle and Functionality
The CR-8000 2023 Release consolidates signal integrity, power integrity, and EMI analysis tools into new bundles, with enhanced user interaction, MultiCore CPU support, and compatibility with extensive datasets. AI/ML-assisted modeling and new Power Integrity checks elevate design and analysis prowess.
Comprehensive Signal Integrity Analysis
Dive into Signal Integrity with the Design Force SI Advance bundle, encompassing features from Characteristic Impedance to IBIS AMI SerDes channel analysis. Comprehensive system-level analysis is ensured through the inclusion of IBIS, SPICE, and S-Parameter models in both domains.
Full-spectrum PCB-level EMI and Power Analysis
The Design Force PI/EMI Advance bundle focuses on EMI and Power Supply System Analysis. Critical functions include rapid estimations, integrity features, and an array of analysis tools designed to optimize designs. Capabilities include IC power pin impedance computation, Decap location and parasitic values determination, DC analysis, incorporation of Lossy Transmission Line models considering copper surface roughness, and integration of IBIS, SPICE, and S-Parameter models. Time Domain Reflectometry (TDR) and Eye Pattern analysis enhance design evaluation. A comprehensive HSPICE export and capability to calculate and export S-Parameter Touchstone data add versatility to the toolset.
With the CR-8000 2023 release, users will be able to explore innovations that redefine design excellence. The release underscores Zuken’s commitment to empowering users with tools that simplify the challenges of intricate electronic design.
For more information about CR-8000 Release 2023 and other Zuken solutions, please visit the CR-8000 section on Zuken.com.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.