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Zuken Unveils CR-8000 2023 with Enhanced Design Efficiency, Analysis for High-Density, High-Speed PCB DesignsAugust 30, 2023 | Zuken
Estimated reading time: 3 minutes
Zuken, a global leader in electronic design automation solutions, announces the availability of CR-8000 2023. The 2023 release is packed with new enhancements covering the entire design process and will empower users and enable them to tackle the challenges of high-density, high-speed PCB designs.
Notably, the CR-8000 2023 release places special emphasis on revitalizing and expanding the spectrum of signal integrity, power integrity, and electromagnetic compatibility (EMC) analysis tools. These advancements are seamlessly integrated into the CR-8000 Design Force Analysis Advance bundle, offering an unparalleled avenue for enhanced design insights.
"We are excited to unveil CR-8000 Release 2023, which empowers designers to address the ever-increasing demands of high-density, high-speed PCB designs," said Kazuhiro Kariya, Sr. Managing Executive Officer and CTO of Zuken Inc. "Through the strategic enhancements made to our flagship CR-8000 tool suite, we are providing our customers with a comprehensive solution that boosts design efficiency and supports accurate analysis, ultimately enabling them to stay ahead in today's competitive market."
Empowering Engineers with Advanced Design Creation
Streamlined Design Sheet Integration
With the CR-8000 2023 release, the process of generating new designs becomes a seamless journey. Users can effortlessly merge sheets from diverse designs, enabling the incorporation of various elements or the utilization of template designs as a solid foundation. This innovative feature fosters creativity and accelerates the design timeline.
Enhanced Information Security
Privacy takes center stage with the introduction of a resourceful feature that allows sensitive information exclusion before external sharing. Tailoring resource files to distinct collaboration needs fosters a secure and collaborative design environment.
Efficiency through Design Reuse
The 2023 release introduces a groundbreaking feature that streamlines documentation by enabling the copying, editing, and seamless integration of circuits and text elements. This innovation enhances efficiency by eliminating redundant tasks and allows engineers to focus on design evolution.
Expanded Design Efficiencies in Layout
Reuse Template Routing
Identical areas of components and routing that are common in multi-channel designs can now be placed and routed based on one instance. This function recognizes component and topology similarities and propagates the master instance to the subsequent channels.
Expanded Contour Routing
An interactive contour routing feature aligns seamlessly with existing patterns and board shapes, ensuring design harmony and consistency.
Analyze Track Configurations
Users can examine the routing of a trace path by visualizing a cross-sectional view that showcases the trajectory across various layers. This capability allows for comprehensive inspection and evaluation of track arrangements, aiding in identifying potential issues and optimizing the design.
Powerful Analysis Capabilities
Enhanced Bundle and Functionality
The CR-8000 2023 Release consolidates signal integrity, power integrity, and EMI analysis tools into new bundles, with enhanced user interaction, MultiCore CPU support, and compatibility with extensive datasets. AI/ML-assisted modeling and new Power Integrity checks elevate design and analysis prowess.
Comprehensive Signal Integrity Analysis
Dive into Signal Integrity with the Design Force SI Advance bundle, encompassing features from Characteristic Impedance to IBIS AMI SerDes channel analysis. Comprehensive system-level analysis is ensured through the inclusion of IBIS, SPICE, and S-Parameter models in both domains.
Full-spectrum PCB-level EMI and Power Analysis
The Design Force PI/EMI Advance bundle focuses on EMI and Power Supply System Analysis. Critical functions include rapid estimations, integrity features, and an array of analysis tools designed to optimize designs. Capabilities include IC power pin impedance computation, Decap location and parasitic values determination, DC analysis, incorporation of Lossy Transmission Line models considering copper surface roughness, and integration of IBIS, SPICE, and S-Parameter models. Time Domain Reflectometry (TDR) and Eye Pattern analysis enhance design evaluation. A comprehensive HSPICE export and capability to calculate and export S-Parameter Touchstone data add versatility to the toolset.
With the CR-8000 2023 release, users will be able to explore innovations that redefine design excellence. The release underscores Zuken’s commitment to empowering users with tools that simplify the challenges of intricate electronic design.
For more information about CR-8000 Release 2023 and other Zuken solutions, please visit the CR-8000 section on Zuken.com.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.