Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
American Standard Circuits Now Offers ENEPIG Surface Finish
September 18, 2023 | American Standard CircuitsEstimated reading time: 1 minute
Illinois-based PCB fabricator, American Standard Circuits, is now offering in-house ENEPIG surface finish. ENEPIG is the solution to multiple surface finish requirements within one multi metal plating operation.
Utilizing nickel as the traditional barrier layer, the Electroless Palladium creates a buffer between the nickel and the gold. This prevents the interaction of the corrosion of the nickel to allow the ion exchange necessary for the Immersion gold. In a traditional ENIG process the nickel is corroded in order to exchange the nickel surface for the immersion gold reaction (reduction). This can lead to intergranular corrosion of the nickel, particularly where the phosphorous and the nickel meet within the co-deposition of nickel and phosphorous (6-9%).
Using Electroless Palladium, the gold is deposited in a partial immersion process (corrosion) which becomes autocatalytic after the initiation of plating of the gold. This removes any corrosion of the nickel and the subsequent risk of Black Pad. In addition to the obvious risk mitigation, it also provides a highly solderable and wire bondable surface without the use of multiple plated thicknesses of electrolytic soft gold. Typically, a thinner gold for solderability (<10µ”) and a thicker deposit for wire bondability (>50µ”).
The ENEPIG process provides the best of both worlds in a single process sequence as well as complete encapsulation of all copper features.
Educational titles from American Standard Circuits:
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
-
Visit I-007eBooks.com?to download these and other free titles.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.