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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 1, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It must be almost fall; my air conditioning hasn’t switched on all day. I love living in Atlanta, but August was so hot that I thought I was going to melt.
As we head into the Labor Day weekend, we have a variety of articles for this week’s editor’s picks. Hannah Nelson discusses the onboarding process she went through when she started a new job. Gaurab Majumdar explains why tech companies should consider hiring workers from India. Happy Holden details the importance of great sensor technology and why sensors are a critical ingredient in Smart manufacturing processes. Mike Brask discusses the new IPS ENIG line installed at the SEL facility in Idaho, and Chris DeMartino explains how Modelithics works to provide simulation models, primarily for the RF/microwave community.
See you next time.
The New Chapter: Smoothing the Rocky Road of Onboarding
Published August 31
If you’ve ever moved to a new city to start a new job, Hannah Nelson’s newest column will ring true. She discusses what it was like to move from Indiana to Arizona for a job, how her new company welcomed her in and helped her onboard successfully, and what lessons she learned from the whole experience.
An Industry-ready Workforce in India
Published August 28
For about a decade, I’ve been reading news articles about India being at a crossroads. But according to IPC India Executive Director Gaurab Majumdar, the country may now be heading out on the highway with the accelerator floored. In this article, Gaurab explains why companies seeking technical staff should consider India, which has a large population of skilled technologists and college students ready to join the workforce.
It All Starts With Sensors
Published August 30
In this article, Happy Holden points out that manufacturing data collection begins with sensors. But the implementation of Smart processes requires much more than just great sensor technology, and you may have to upskill your staff or hire experts to take you to the finish line. As Happy says, “Time does not favor the procrastinator.”
Innovations in Final Finishing
Published August 31
One centerpiece of the new SEL facility in Idaho is the fully automated IPS ENIG line, which measures 81 feet in length. In this interview, IPS President Mike Brask explains how this line was custom-built for SEL to include a variety of features not usually seen in North America.
Model Citizens: Modelithics
Published August 28
We recently spoke with Chris DeMartino, an applications engineer at Modelithics, about the company’s business “model” of providing simulation models for the RF and microwave industries. Creating models is a tedious job for PCB designers and design engineers, so this could wind up being a real time-saver.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).