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Indium to Highlight Advanced Thermal Management Solutions for Supercomputing at SC26

11/13/2026 | Indium Corporation
Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of high-reliability, AI-enabling advanced materials at the International Conference for High Performance Computing, Networking, Storage, and Analysis (SC26), November 17-19, in Chicago, Illinois.

Indium President and CEO Ross Berntson Receives Regional Businessperson of the Year Award

11/10/2026 | Indium Corporation
Indium Corporation President and CEO Ross Berntson has been named the 2026 Businessperson of the Year by the Greater Utica (New York) Chamber of Commerce, recognizing his leadership in advancing innovation, manufacturing excellence, workforce development, and community engagement.

Micron Invests in New York Critical Minerals Processing with Indium Corporation

10/29/2026 | Micron
Micron Technology, Inc. announced an investment in critical minerals processing and high-purity materials manufacturing that is expected to support the expansion of Indium Corporation’s capabilities in Central New York, restarting domestic processing of critical minerals essential to advanced semiconductor manufacturing.

Indium Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX China

10/28/2026 | Indium Corporation
Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs) and their role in addressing the demands of next-generation cooling applications at TestConX China, October 29, in Suzhou, China.

Indium Halogen-Free Solder Paste Wins Mexico Technology Award

10/16/2026 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, received a Mexico Technology Award in the solder paste category for its Indium12.9HF, a no-clean, halogen-free solder paste designed to meet the growing challenges of high-density, fine-pitch assemblies.
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