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Sinclair Manufacturing Orders Hentec/RPS Pulsar Solderability Testing and Photon Steam Aging Systems
September 13, 2023 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Sinclair Manufacturing has purchased Pulsar solderability testing and Photon steam aging systems for installation in their Chartley, Massachusetts facility.
The Pulsar utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.
The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications. These steam aging systems complement component lead tinning machines designed to perform component re-tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability military and aerospace applications.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.