Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Fresh PCB Concepts: PCB Plating Process Overview
Cadence Next-Gen AI-Driven OrCAD X Delivers Up to 5X Faster PCB Design with Cadence OnCloud
September 13, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced the new Cadence OrCAD X Platform, a cloud-enabled system design solution that offers transformative improvements in ease of use, performance, automation and collaboration. The new OrCAD X Platform streamlines the system design process and empowers designers through cloud scalability and AI-powered placement automation technology, enabling up to 5X reduction in design turnaround time.
With significantly higher productivity enabled by cloud-connected capabilities—including data management, collaborative layout design and a new easy-to-use layout environment optimized for small and medium businesses—this next-generation platform includes everything in the OrCAD platform and more. Supercharged with powerful layout productivity improvements based on the Cadence Allegro® X Platform, it provides complete backward data compatibility with OrCAD and Allegro technologies.
The new OrCAD X platform provides the following benefits:
- Cloud-enabled: Improves productivity with real-time access to data management via the Cadence OnCloud Platform. Data storage and management through a cloud login enables a hybrid work environment across the desktop and the cloud, reducing infrastructure costs for the user.
- Ease of use: Optimized for small and medium businesses, the OrCAD X platform offers a new, easy-to-learn and easy-to-use PCB layout canvas while retaining the power of industry-proven engines. New cloud-based licensing options are available as well as many user-experience enhancements from installation through design. The dynamic creation of manufacturing documentation provides a real-time view of fabrication details throughout the entire design process.
- Faster turnaround time: Significantly enriched electrical constraints, performance improvements and integration with the broader Cadence system design and analysis portfolio enable faster time to market.
- Collaboration: Cloud-hosted collaboration allows multiple designers to work concurrently on the same layout design.
The OrCAD X platform can access automated placement through the Allegro X AI system, which enables transformative placement time reduction from days to minutes. Users can achieve these placement time reductions while simultaneously addressing signal integrity, power integrity and thermal design effects during placement, routing of critical signals and the generation of power planes.
“Cadence is committed to delivering optimal system design solutions that incorporate the power of generative AI and the cloud to enable the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D in the Custom IC & PCB Group at Cadence. “The new OrCAD X platform will have a transformative impact, offering customers greater productivity through ease of use, cloud-enabled data management, AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The AI-based OrCAD X platform supports Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation. Customers can learn more about the OrCAD X platform at the PCB West 2023 conference and exhibition, September 19-22 in Santa Clara, Calif. or by visiting Cadence's website.
Share on:
Suggested Items
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.