Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
An Overview of Rigid-flex Design
September 13, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
For this month’s issue on rigid-flex design, we spoke with instructor Kris Moyer, who teaches the IPC class “PCB Design for Flex and Rigid-Flex Boards.” In this wide-ranging interview, Kris breaks down the hurdles facing rigid-flex designers and offers a variety of solutions for rigid board designers taking on their first rigid-flex circuits. He also provides a few horror stories to illustrate what happens if you don’t follow sound design practices, rules, and standards. And, as Kris points out, “Your fabricator is your friend.”
Andy Shaughnessy: What are you trying to get across to the students when you’re teaching rigid-flex design? What are the biggest challenges?
Kris Moyer: One of the biggest concepts I want to get across to students is that there are a lot of untapped, unforeseen, intangible benefits to rigid-flex, both from a design point of view and a total cost of ownership point of view. Rigid boards are usually connected with wire harnesses or cables, and we know that wire harnesses and cables are the largest point of failure in the system. Wires and cables tend to break, especially at the solder joints or pins. If we can remove all those harnesses and integrate all of that into the structure of the board, we can vastly reduce the failure rate of our designs.
If you choose to go rigid-flex, there is an initial cost expenditure: added processes, time, complexity, and all of that. But let's say I have a design with three circuit boards that would need two cable harnesses, one from board one to board two, and one from board two to board three. That's a grand total of five different item numbers I would need for each board. I would have three drawing numbers: a number for the schematic, a number for the board, and a number for the assembly. For three boards, that's nine drawings I must maintain, and then another two drawings per cable, and let's assume two cables. That's a total of 13 separate drawings and part numbers I have to maintain in my system.
To read this entire conversation, which appeared in the September 2023 issue of Design007 Magazine, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.