Fresh PCB Concepts: The Importance of Bare Board Testing for Reliability
Elementary, Mr. Watson: Design Intent Over Design Speed
Beyond Design: Managing Linear Workflow Bottlenecks
MKS’ Atotech to Participate in IPCA Expo 2023
September 14, 2023 | MKS’ AtotechEstimated reading time: Less than a minute
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
At booth EF 51 Atotech® product experts will be introducing the combination of wet chemical processes, production equipment (plating lines, lasers, auxiliaries) and software solutions. A spotlight is set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components. This year highlights include:
- V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
- GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- CupraEtch® DF 8000: Low etch rate and etch depth dry film pretreatment
- Noviganth® AF 76: High build self-accelerating electroless copper
- OS Tech® SIT 2: The OSP solution combinable with ENIG
- Stannopure® PF 10: High-speed green tin process for lead frames and connectors
- InPro® MVF 2: Next-generation blind micro via filling in VCP for HDI production
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.
Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
12/29/2025 | ElephantechJapanese deep-tech Elephantech announced successful development of an innovative process to form High-Density Interconnect (HDI) microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
TopLine Introduces Cost-Efficient Flip Chips with Daisy Chain for Electrical Test Learning
12/23/2025 | TopLine CorporationFlip Chips with Daisy Chain from TopLine Corporation are a cost-efficient way to learn electrical test for engineers seeking to understand and practice necessary techniques for working with Flip Chip components.
Elephantech Launches Copper-on-Copper Self-Assembled Nanoparticles
12/22/2025 | ElephantechJapanese deep-tech startup Elephantech Inc. announced the successful development of Self-Assembled Copper Nanoparticles (SA-CuNP), a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.
Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging
12/24/2025 | Matt Stevenson -- Column: Connect the DotsIf you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.