-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePartial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
MKS’ Atotech to Participate in IPCA Expo 2023
September 14, 2023 | MKS’ AtotechEstimated reading time: Less than a minute
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
At booth EF 51 Atotech® product experts will be introducing the combination of wet chemical processes, production equipment (plating lines, lasers, auxiliaries) and software solutions. A spotlight is set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components. This year highlights include:
- V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
- GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- CupraEtch® DF 8000: Low etch rate and etch depth dry film pretreatment
- Noviganth® AF 76: High build self-accelerating electroless copper
- OS Tech® SIT 2: The OSP solution combinable with ENIG
- Stannopure® PF 10: High-speed green tin process for lead frames and connectors
- InPro® MVF 2: Next-generation blind micro via filling in VCP for HDI production
Suggested Items
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.
Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation
10/01/2024 | Michael Carano -- Column: Trouble in Your TankIt has been well documented that, with a very expensive and complex printed circuit board, thermal and mechanical excursions often find weaknesses. A lack of robustness and poor process control often leads to the exploitation of those weaknesses. An interconnect defect (ICD) often goes undetected until the printed circuit board reaches the final assembly stage or undergoes multiple thermal cycles, including interconnect stress tests or thermal shock. It is impossible to rework the ICD defect. But unlike voids, if detected in time, the panels can be reprocessed.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
09/11/2024 | Michael Carano -- Column: Trouble in Your TankFor 40 years, I have been involved in the printed circuit board, circuit board assembly, and semiconductor technology segments, preaching about minimizing defects and improving yields. This is especially true as technology becomes increasingly complex, and additional focus must be placed on yield improvements. Process management and wet process control must be front and center, so it’s quite interesting and timely to talk about wet process control and management for this month’s issue. This theme fits quite well with today's global events. For this industry, the technical curve has steepened dramatically in the past few years.
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.