Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Trouble in Your Tank: Things You Can Do for Better Wet Process Control

09/11/2024 | Michael Carano -- Column: Trouble in Your Tank
For 40 years, I have been involved in the printed circuit board, circuit board assembly, and semiconductor technology segments, preaching about minimizing defects and improving yields. This is especially true as technology becomes increasingly complex, and additional focus must be placed on yield improvements. Process management and wet process control must be front and center, so it’s quite interesting and timely to talk about wet process control and management for this month’s issue. This theme fits quite well with today's global events. For this industry, the technical curve has steepened dramatically in the past few years.

Atotech to Participate at KPCA Show 2024

09/03/2024 | Atotech
MKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.

Victory Announces Breakthrough in PCB Technology with New Product Launch

08/29/2024 | openPR
Shenzhen Victory Electronics Technology Co., Ltd., a leader in the printed circuit board (PCB) manufacturing industry, is proud to announce the successful development of a groundbreaking new product.

Connect the Dots: Designing for Reality—Electroless Copper

08/28/2024 | Matt Stevenson -- Column: Connect the Dots
Roll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.

Maximizing ROI Through Better Wet Process Control

08/20/2024 | I-Connect007 Editorial Team
“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in