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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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ECD Engineering Team Expands with Addition of Software Development Engineer
September 18, 2023 | ECDEstimated reading time: 1 minute
ECD announced that Seydina Diop has joined the company’s growing engineering team as a Software Engineer II. This is the second ECD engineering hire in less than a year, as the company has committed to—and is achieving—an accelerated product development roadmap.
Diop, an experienced full-stack software developer who has been writing code since childhood, brings over ten years of experience to the ECD team. He previously worked for an online design goods marketplace where he managed the company’s social media presence and provided technical support, metrics analysis, and troubleshooting to improve the user experience. His unique skill set unites back-end and front-end technical knowledge with artistic presentation, bringing operational robustness and user perspective to his craft.
“I describe myself as having an engineer’s brain with an artist’s eye,” comments Diop. “It’s one thing to understand and be able to develop technically sound code. It’s quite another to marry that skill with artistic conceptualization to ensure the user experience is visually rich, intuitive, and consistent across multiple platforms. That’s what I intend to help deliver for ECD users.”
Initially focused on enhancements to the company’s popular OvenSENTINEL™ continuous reflow soldering monitoring technology, Diop’s future assignments include the development of baking-centric profiling software, portfolio-wide MAP profiling software upgrades, and adding customer-requested features to several popular ECD products.
Micheal Pliska, ECD Director of Engineering, says, “Seydina is a great addition to our team, allowing us to bring key software responsibilities in-house which has tightened the feedback loop and enabled fast implementation. He’s already been instrumental in adding OvenSENTINEL product support for global regions and has begun working on major upgrades to other ECD product lines.”
Diop holds a B.S. in computer science and is proficient in multiple front-end, back-end, and database programming languages, including HTML, CSS, JavaScript, Python, C#, C++, and SQL, among others. He is based in ECD’s Milwaukie, Oregon headquarters.
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Rachael Temple - AlltematedSuggested Items
Get Uncomfortable or Get Run Over: How AI Is Reshaping the EMS Industry
12/17/2025 | Mark Wolfe, Global Electronics AssociationImagine crossing a highway blindfolded. You might make it across a few times, but if traffic builds, the odds catch up. In the EMS industry, ignoring AI feels much the same way. You can keep doing what worked in the past, but as the pace of change accelerates, standing still becomes the riskiest move of all. After hosting my first EMS leadership roundtable earlier this year, I found myself repeating a line that has since become a theme: “You need to get uncomfortable and start to understand this stuff, or it will run you over.”
SEMI Europe, Partners Host High-Level Forum to Tackle Semiconductor Talent Gap
09/19/2025 | SEMISEMI Europe, in partnership with the European Chips Diversity Alliance (ECDA), the European Chips Skills Academy (ECSA), OECD, and EU STEM Coalition, has invited policymakers, educators, and industry leaders to join its forum on “Accelerating Europe’s Tech Advantage” in Brussels on October 2, 2025.
ECD to Showcase New M.O.L.E. EV6 Features, Preview Expanding Touchscreen Thermal Profiling Portfolio at productronica 2023
10/17/2023 | ECDSince the launch of the first-ever touch control thermal profiler, M.O.L.E. EV6, ECD’s new tool has enjoyed wide industry uptake and has recently integrated additional features like Bluetooth® wireless connectivity.
ECD Names New Director of Engineering to Lead Product Development and Innovation Initiatives
12/07/2022 | ECDECD announced that it has hired Michael Pliska as its new Director of Engineering, supporting all product lines and market sectors.
Atotech Experts Will Present at Global Semiconductor & Electronics Forum
06/14/2021 | AtotechAtotech, a global supplier of specialty chemicals, equipment, software, and services announced that it will be presenting at the upcoming Global Semiconductor & Electronics Forum on Semiconductor innovation, Thursday, June 17, 2021.