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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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StratEdge Reveals High-Performance Semiconductor Packages at European Microwave Week, IMAPS International, and IEEE BCICTS
September 19, 2023 | StratEdgeEstimated reading time: Less than a minute
StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including European Microwave Week (EuMW), September 19-21, IMAPS International, October 3-4, and IEEE BCICTS, October 16-17. StratEdge packages dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) and operate from DC to 63+ GHz. The packages provide ultra-low loss performance over a wide range of frequencies, depending on the style and mounting configuration. Many open-tooled designs are available with 50 ohm impedance, which provide convenience and ease for packaging your high-performance semiconductors.
Casey Krawiec, VP of Global Sales at StratEdge, emphasized, "We manufacture our packages with precision, using post-fired ceramics with laser-cut features to control tight tolerances, thermally-enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. For further optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, equipped with the latest precision wire bonding and die attach systems."
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StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
05/07/2025 | StratEdgeStratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”