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TopLine to Present at IMAPS Symposium 2023

08/11/2023 | TopLine
Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages” at IMAPS 2023 in San Diego, California, October 4, 2023.

TopLine to Present at NASA ETW June 13

06/05/2023 | TopLine
Martin Hart, CEO of TopLine Corporation, will deliver a presentation titled “Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers” at the upcoming 14th Annual NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop (ETW) June 13.

Knocking Down the Bone Pile: Package on Package Rework—Skill Required

04/28/2023 | Bob Wettermann -- Column: Knocking Down the Bone Pile
Package-on-package (PoP) is an electronic component-stacked package type consisting of vertically stacked ball grid arrays most commonly in a two-high stack. The package closest to the board is the logic/CPU component and is more commonly known as the “bottom” package. The “top” package sits on top of this module and is the memory module. These packages are generally found in consumer electronics (mobile devices) such as smartphones, tablets, and netbooks. These packages tend to be high IO count, fine pitch, very thin packages.

Kickstart Your Automation Journey with ViTrox’s TR1000S?i!

03/30/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce the launch of the enhanced Tray-based Vision Handler, TR1000S?i!

Knocking Down the Bone Pile: 2023’s Top Challenges in BGA Rework

03/01/2023 | Bob Wettermann -- Column: Knocking Down the Bone Pile
Over seven years ago, I put pen to paper to enumerate the top challenges needing to be overcome for a successful BGA rework. With the continued advancement of BGA technology, it’s time to apply a fresh coat of paint to that list. Read on to find out my revised take on today’s top BGA rework challenges. As devices become more complex and computing power requirements increase, the maximum physical size of BGA packages has increased as well. Currently, some devices in development are planned to be 125 mm x 125 mm in size. These large package sizes present some very challenging scenarios for rework process technicians.
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