Rigid-flex DFA
September 19, 2023 | Andy Shaughnessy, Design007Estimated reading time: 1 minute

Rigid-flex assembly brings its own set of issues, but designers can do quite a bit to make things easier on their downstream brethren. We asked IPC instructor Kris Moyer to give us the lowdown on DFA for rigid-flex circuitry.
Kris, what are some of the unique challenges related to assembling rigid-flex circuits?
There are several challenges to assembly of rigid-flex boards. First there is the alignment issue of the different sections of the boards. With a rigid board, the individual boards can be removed from the fabrication panel and run through the SMT assembly line without much problem, as long as the board is of sufficient size. In this case, the relative position of all the individual parts on the board remains consistent. But with rigid-flex, after the board is removed from the fabrication panel, the individual boards can move and rotate relative to each other within the limits of the flex material. This makes the placement of parts difficult to control. To overcome this, the board must be held in a restrained condition throughout the assembly process. This will require either the fabrication of a custom fixture to hold the board restrained during assembly or the design of temporary removable restraining mechanisms (rails) into the design of the board.
To read this entire conversation, which appeared in the September 2023 issue of Design007 Magazine, click here.
Suggested Items
Real Time with... IPC APEX EXPO 2025: SPEA—Optimizing Testing Processes in PCBA
04/10/2025 | Real Time with...IPC APEX EXPOMike Sexton and Dustin Warren of SPEA explore market dynamics for PCBA manufacturers. They emphasize the need for optimizing testing processes, introducing deep In-Circuit Test (ICT) technology that identifies weak components often overlooked by traditional tests. The discussion also covers flying probe technology, highlighting its flexibility for high-mix, low-volume production and comparing it with ICT testing methods.
Nano Dimension Appoints Ofir Baharav as CEO
04/08/2025 | Nano DimensionNano Dimension Ltd., a digital manufacturing leader, announced the appointment of Mr. Ofir Baharav as its new Chief Executive Officer, effective immediately.
Acquisition of MADES Strengthens Cicor's Pan-European Leadership in the Aerospace & Defense Sector
04/03/2025 | CicorCicor Group announces that it has signed an agreement to acquire 100% of the shares of Spanish electronics company Malaga Aerospace, Defense & Electronics Systems S.A.U. (MADES). The company focuses on electronic solutions for the aerospace and defense industry, which accounts for well over half of its business.
Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market
04/03/2025 | Real Time with...IPC APEX EXPORich Depoto discusses Uyemura's focus on specialty chemicals and market trends, particularly the shift towards HDI and UHDI products. Rich highlights innovations in surface adhesion and micro etches for copper, essential for high-speed transmission.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.