Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024

12/12/2024 | TPCA
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%.

Fresh PCB Concepts: PCB Plating Process Overview

12/12/2024 | Team NCAB -- Column: Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.

Has the Time Finally Come for Tin-nickel Plating?

12/09/2024 | Marcy LaRont, PCB007 Magazine
In the 1980s, Electrochemicals, Inc. (now Electrochemical Products) made a significant shift from furniture and industrial goods to electronics and manufacturing. During this journey, a tin-nickel plating alloy was developed. In 1984, Mike Carano, a young engineer, published a paper on tin-nickel plating alloy, but after some initial attention, the plating solution fell into obscurity. Today, PCB fabrication looks largely the same, yet changes are afoot, chiefly due to the demands for very fine feature capability on printed circuit boards, as well as environmental sustainability. So, in this fascinating conversation with Mike Carano and Happy Holden, we take another look at tin-nickel and its advantages in both performance and sustainability.

Flex PCB Design Best Practices with Dave Lackey

12/04/2024 | Brittany Martin, I-Connect007
David Lackey, a flex circuit expert at American Standard Circuits, speaks about the advantages and challenges of designing with flexible and rigid-flex PCBs. He also discusses how consulting before the design phase can save time and costs by avoiding manufacturing issues and highlights the reliability and packaging benefits of flex technology, especially for compact designs in sectors like aerospace.

Connect the Dots: Designing for Reality: Strip-Etch-Strip

12/05/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in