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Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.

Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA

06/01/2026 | Cadence Design Systems
At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy.

Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand

05/29/2026 | Cadence Design Systems
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology.

Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency

05/11/2026 | Cadence Design Systems
Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications.

Cadence Reports Q1 2026 Financial Results

04/28/2026 | Cadence Design Systems
Cadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
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