Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

XJTAG Launches Free Standalone ODB++ Layout Viewer for Fast PCB Signal Navigation

04/28/2026 | XJTAG
XJTAG®, a trusted name in electronics testing and programming, announced the release of a free standalone Layout Viewer, designed to help engineers quickly view PCB designs using ODB++ data without requiring access to full CAD systems or test environments.

Zero Touch Data Package: The Future of Seamless PCB Manufacturing

05/22/2025 | Dana Korf, Victory Giant Technology
Imagine a day when a design data file—not a traditional documentation package—is output directly from the eCAD system, transmitted to selected fabricators, and automatically loaded into their engineering/CAM systems, initiating tooling and production without any human intervention. This is zero touch data transfer in action. By eliminating manual processes, front-end personnel at fabrication facilities can be redeployed to strategic areas such as R&D and customer engagement.

Speaking the Same Language as Your Fabricator

03/12/2025 | Andy Shaughnessy, Design007 Magazine
We do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.

Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024

08/29/2024 | Takaya
TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will be exhibiting highlights of its advanced technology at SMTA International, October 20 - 24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois USA. 

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/15/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in