-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes
September 21, 2023 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum. The event is scheduled to take place on October 25-26, 2023, at the esteemed Expo Guadalajara in Jalisco, Mexico. Miguel Carbajal, KIC’s dedicated Mexico Sales Manager, and Miles Moreau, General Manager, will be in Booth 1101 to engage with industry experts and engineering professionals and discuss the latest developments and innovations.
At the event, KIC will showcase its groundbreaking advancements in process optimization and recipe refinement strategies as well as its latest state-of-the-art sensing technologies. These cutting-edge solutions are designed to address challenges related to defects reduction, improved Overall Equipment Effectiveness (OEE) and product quality, oven performance tracking, and innovative thermal profiling methodologies.
The dynamic landscape of electronics manufacturing, especially within the automotive sector in Mexico, demands intelligent utilization of extensive data to foster flexible, efficient, and successful manufacturing operations. KIC’s acclaimed “Heat to Data™” approach presents a comprehensive ecosystem encompassing all facets of electronics assembly and semiconductor packaging thermal processes. The company's solutions effectively tackle the challenges of temperature profiling, process setup, and inspection/monitoring, while also facilitating automation, traceability, and connectivity across diverse sectors including automotive, medical, aerospace, network, and military markets.
Suggested Items
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Teledyne FLIR, VSI Labs Testing Shows How Thermal Imaging Helps Vehicle Makers Meet Nighttime AEB Federal Safety Standards
12/12/2024 | BUSINESS WIRETeledyne FLIR OEM, part of Teledyne Technologies Incorporated, in collaboration with VSI Labs today issued test results utilizing the new Federal Motor Vehicle Safety Standard (FMVSS) No. 127 pedestrian automatic emergency braking (PAEB) testing scenarios.