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KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes
September 21, 2023 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum. The event is scheduled to take place on October 25-26, 2023, at the esteemed Expo Guadalajara in Jalisco, Mexico. Miguel Carbajal, KIC’s dedicated Mexico Sales Manager, and Miles Moreau, General Manager, will be in Booth 1101 to engage with industry experts and engineering professionals and discuss the latest developments and innovations.
At the event, KIC will showcase its groundbreaking advancements in process optimization and recipe refinement strategies as well as its latest state-of-the-art sensing technologies. These cutting-edge solutions are designed to address challenges related to defects reduction, improved Overall Equipment Effectiveness (OEE) and product quality, oven performance tracking, and innovative thermal profiling methodologies.
The dynamic landscape of electronics manufacturing, especially within the automotive sector in Mexico, demands intelligent utilization of extensive data to foster flexible, efficient, and successful manufacturing operations. KIC’s acclaimed “Heat to Data™” approach presents a comprehensive ecosystem encompassing all facets of electronics assembly and semiconductor packaging thermal processes. The company's solutions effectively tackle the challenges of temperature profiling, process setup, and inspection/monitoring, while also facilitating automation, traceability, and connectivity across diverse sectors including automotive, medical, aerospace, network, and military markets.
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Brent Fischthal - Koh YoungSuggested Items
IEEE Study Shows Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics
07/22/2025 | PRNewswireMulti-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size increases thermal crosstalk, which may affect laser efficiency and reliability.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Eco-Scouts Initiative: Rehm Apprentice Team Receives Jury Award
07/04/2025 | Rehm Thermal SystemsAt the end of May, as part of this year’s ECO-Scouts Initiative, 14 interdisciplinary apprentice teams from various companies presented their project results to a panel of experts.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.