Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes
September 21, 2023 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum. The event is scheduled to take place on October 25-26, 2023, at the esteemed Expo Guadalajara in Jalisco, Mexico. Miguel Carbajal, KIC’s dedicated Mexico Sales Manager, and Miles Moreau, General Manager, will be in Booth 1101 to engage with industry experts and engineering professionals and discuss the latest developments and innovations.
At the event, KIC will showcase its groundbreaking advancements in process optimization and recipe refinement strategies as well as its latest state-of-the-art sensing technologies. These cutting-edge solutions are designed to address challenges related to defects reduction, improved Overall Equipment Effectiveness (OEE) and product quality, oven performance tracking, and innovative thermal profiling methodologies.
The dynamic landscape of electronics manufacturing, especially within the automotive sector in Mexico, demands intelligent utilization of extensive data to foster flexible, efficient, and successful manufacturing operations. KIC’s acclaimed “Heat to Data™” approach presents a comprehensive ecosystem encompassing all facets of electronics assembly and semiconductor packaging thermal processes. The company's solutions effectively tackle the challenges of temperature profiling, process setup, and inspection/monitoring, while also facilitating automation, traceability, and connectivity across diverse sectors including automotive, medical, aerospace, network, and military markets.
Share on:
Suggested Items
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/30/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.